公开(公告)号：US20220185677A1

公开(公告)日：2022-06-16

申请号：US17603075

申请日：2019-04-15

申请人： CHUBU ELECTRIC POWER CO., INC. ,  NISSAN TANAKA CORPORATION

发明人： Daisuke Ihara ,  Yoshimi Sano ,  Hirohumi Yoshimoto ,  Hideaki Shimizu ,  Hideaki Hashimoto ,  Akihiro Takeuchi ,  Kiyofumi Higashimoto

IPC分类号： C01B32/914 ,  H05H1/34 ,  C04B35/56

摘要： Hafnium carbide powder for plasma electrodes is represented by a chemical formula HfCx (where x=0.5 to 1.0). The content of carbon particles contained as impurities in the hafnium carbide powder is less than or equal to 0.03% by mass. The hafnium carbide powder preferably has an average particle size of 0.5 to 2 μm. To produce the hafnium carbide powder, a pellet made from mixed powder of hafnium oxide and carbon is first placed in a second crucible made of silicon carbide. Then, the hafnium carbide powder is formed by heating the second crucible at 1800 to 2000° C. with the second crucible arranged in a first crucible made of carbon.

公开(公告)号：US09434024B2

公开(公告)日：2016-09-06

申请号：US14350064

申请日：2012-10-17

申请人： NISSAN TANAKA CORPORATION

发明人： Shinji Numata ,  Hirotaka Kamikihara ,  Yoshimi Sano

IPC分类号： B23K26/08 ,  B23K26/14 ,  B23K26/38

CPC分类号： B23K26/14 ,  B23K26/08 ,  B23K26/0869 ,  B23K26/0884 ,  B23K26/1435 ,  B23K26/38

摘要： A laser cutting device includes a control unit which sets a steady oxygen concentration, a moving speed of a laser nozzle and laser beam steady control conditions based on a material and a plate thickness of the workpiece, decreases the moving speed of the laser nozzle to a first setting speed when the laser nozzle arrives a first setting position in front of an end point of a cutting trajectory, and decreases a relative moving speed of the laser nozzle to a second setting speed by varying the oxygen concentration of the cutting gas and the control condition of the laser beam when the laser nozzle arrives at a second setting position.

摘要翻译： 激光切割装置包括控制单元，其设置稳定的氧浓度，激光喷嘴的移动速度和基于工件的材料和板厚度的激光束稳定控制条件，将激光喷嘴的移动速度降低到 当激光喷嘴到达切割轨迹的终点前的第一设定位置时的第一设定速度，并且通过改变切割气体的氧浓度和控制器将激光喷嘴的相对移动速度降低到第二设定速度 当激光喷嘴到达第二设定位置时激光束的状态。

公开(公告)号：US20140246405A1

公开(公告)日：2014-09-04

申请号：US14350064

申请日：2012-10-17

申请人： NISSAN TANAKA CORPORATION

发明人： Shinji Numata ,  Hirotaka Kamikihara ,  Yoshimi Sano

IPC分类号： B23K26/08 ,  B23K26/38 ,  B23K26/14

CPC分类号： B23K26/14 ,  B23K26/08 ,  B23K26/0869 ,  B23K26/0884 ,  B23K26/1435 ,  B23K26/38

摘要： A laser cutting device includes a control unit which sets a steady oxygen concentration, a moving speed of a laser nozzle and laser beam steady control conditions based on a material and a plate thickness of the workpiece, decreases the moving speed of the laser nozzle to a first setting speed when the laser nozzle arrives a first setting position in front of an end point of a cutting trajectory, and decreases a relative moving speed of the laser nozzle to a second setting speed by varying the oxygen concentration of the cutting gas and the control condition of the laser beam when the laser nozzle arrives at a second setting position.

摘要翻译： 激光切割装置包括控制单元，其设置稳定的氧浓度，激光喷嘴的移动速度和基于工件的材料和板厚度的激光束稳定控制条件，将激光喷嘴的移动速度降低到 当激光喷嘴到达切割轨迹的终点前的第一设定位置时的第一设定速度，并且通过改变切割气体的氧浓度和控制来将激光喷嘴的相对移动速度降低到第二设定速度 当激光喷嘴到达第二设定位置时激光束的状态。