公开(公告)号：US11123967B2

公开(公告)日：2021-09-21

申请号：US16498117

申请日：2018-03-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kurato Akiba ,  Yuta Kuroki

IPC: B32B27/30 ,  B32B27/32 ,  B29C33/68 ,  B32B7/06

Abstract: A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.