公开(公告)号：US10435591B2

公开(公告)日：2019-10-08

申请号：US14394002

申请日：2013-04-24

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshinori Watanabe ,  Hiroki Kigami ,  Yuta Kuroki

IPC: C09J7/20 ,  C09J7/21

Abstract: An adhesive tape substrate production method disclosed in the present description includes the steps of: decreasing the amount of a sizing agent contained in a glass cloth by heat; impregnating the glass cloth for which the amount of the sizing agent has been decreased with a dispersion of a fluorine resin; and heating the impregnated glass cloth to a temperature equal to or higher than a melting point of the fluorine resin. Thus, an adhesive tape substrate including the glass cloth impregnated with the fluorine resin is obtained. This method are more productive of adhesive tape substrates and adhesive tapes than conventional methods. In addition, adhesive tape substrates and adhesive tapes for which the occurrence of defects in appearance are reduced can be produced.

公开(公告)号：US10224551B2

公开(公告)日：2019-03-05

申请号：US15027955

申请日：2014-07-18

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta Kuroki

IPC: H01M4/88 ,  B32B27/30 ,  B32B15/00 ,  B32B15/04 ,  B32B15/08 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  H01M8/1004 ,  H01M8/1018 ,  B05D1/18 ,  B05D3/00

Abstract: The present invention provides a sheet for thin layer transfer (10) including: a substrate (1) including a thin metal film or a thin heat-resistant resin film; and a fluorine resin layer (2) provided on at least one side of the substrate (1). The sheet for thin layer transfer thus provided can have reduced surface irregularities and be less prone to deteriorate even when subjected to repeated thermal transfer by thermocompression bonding.

公开(公告)号：US20150072580A1

公开(公告)日：2015-03-12

申请号：US14394002

申请日：2013-04-24

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshinori Watanabe ,  Hiroki Kigami ,  Yuta Kuroki

IPC: C09J7/02

CPC classification number: C09J7/205 ,  C09J7/21 ,  C09J2201/122 ,  C09J2201/16 ,  C09J2400/143 ,  C09J2400/263 ,  C09J2427/006 ,  Y10T442/2098 ,  Y10T442/2992

Abstract: An adhesive tape substrate production method disclosed in the present description includes the steps of: decreasing the amount of a sizing agent contained in a glass cloth by heat; impregnating the glass cloth for which the amount of the sizing agent has been decreased with a dispersion of a fluorine resin; and heating the impregnated glass cloth to a temperature equal to or higher than a melting point of the fluorine resin. Thus, an adhesive tape substrate including the glass cloth impregnated with the fluorine resin is obtained. This method are more productive of adhesive tape substrates and adhesive tapes than conventional methods. In addition, adhesive tape substrates and adhesive tapes for which the occurrence of defects in appearance are reduced can be produced.

Abstract translation: 本说明书中公开的粘合带基材的制造方法包括以下步骤：通过加热减少玻璃布中所含的上浆剂的量; 浸渍施胶剂量随着氟树脂分散而降低的玻璃布; 并将浸渍过的玻璃布加热到等于或高于氟树脂的熔点的温度。 因此，获得包含浸渍有氟树脂的玻璃布的胶带基材。 与常规方法相比，该方法的粘合带基材和粘合带的生产率更高。 此外，可以制造出能够减少外观缺陷发生的胶带基材和胶带。

公开(公告)号：US11834761B2

公开(公告)日：2023-12-05

申请号：US16551302

申请日：2019-08-26

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshinori Watanabe ,  Hiroki Kigami ,  Yuta Kuroki

IPC: C09J7/21 ,  B32B27/32 ,  C09J7/20 ,  D03D15/267

CPC classification number: D03D15/267 ,  B32B27/322 ,  C09J7/21 ,  B32B2327/12 ,  B32B2327/18 ,  C09J7/205 ,  C09J2301/122 ,  C09J2301/16 ,  C09J2400/143 ,  C09J2400/263 ,  C09J2427/006 ,  D10B2101/06 ,  Y10T442/2098 ,  Y10T442/2992 ,  Y10T442/3878

Abstract: An adhesive tape substrate production method disclosed in the present description includes the steps of decreasing the amount of a sizing agent contained in a glass cloth by heat; impregnating the glass cloth for which the amount of the sizing agent has been decreased with a dispersion of a fluorine resin; and heating the impregnated glass cloth to a temperature equal to or higher than a melting point of the fluorine resin. Thus, an adhesive tape substrate including the glass cloth impregnated with the fluorine resin is obtained. This method are more productive of adhesive tape substrates and adhesive tapes than conventional methods. In addition, adhesive tape substrates and adhesive tapes for which the occurrence of defects in appearance are reduced can be produced.

公开(公告)号：US11123967B2

公开(公告)日：2021-09-21

申请号：US16498117

申请日：2018-03-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kurato Akiba ,  Yuta Kuroki

IPC: B32B27/30 ,  B32B27/32 ,  B29C33/68 ,  B32B7/06

Abstract: A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.