公开(公告)号：US11254844B2

公开(公告)日：2022-02-22

申请号：US16579656

申请日：2019-09-23

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi Sasaki ,  Kouji Mizuno ,  Takayuki Toda

IPC: C09J7/38 ,  C09J201/02

Abstract: Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa·N).