公开(公告)号：US20210114360A1

公开(公告)日：2021-04-22

申请号：US16497930

申请日：2018-03-28

Applicant: NITTO DENKO CORPORATION

Inventor： Masahiko WATANABE ,  Yuta SHIMAZAKI ,  Taichi WATANABE ,  Yusuke YAMAMOTO ,  Tomohiro KONTANI

IPC: B32B27/40 ,  B32B7/022 ,  B32B7/027 ,  B32B7/12

Abstract: The heat-shielding heat insulating substrate is a heat-shielding heat insulating substrate including a transparent substrate layer and an infrared reflection layer, the heat-shielding heat insulating substrate including: a protective topcoat layer arranged on a side of the infrared reflection layer opposite to the transparent substrate layer; and a protective film arranged on a surface of the protective topcoat layer opposite to the infrared reflection layer, wherein a 180° peel strength of the protective film to the protective topcoat layer under an environment having a temperature of 23±1° C. and a humidity of 50±5% RH is from 0.01 N/50 mm to 0.40 N/50 mm, and wherein a 180° peel strength of the protective film to the protective topcoat layer after storage of the heat-shielding heat insulating substrate under an environment having a temperature of 80±1° C. for 10 days is from 0.01 N/50 mm to 1.0 N/50 mm.