公开(公告)号：US20220363035A1

公开(公告)日：2022-11-17

申请号：US17619635

申请日：2020-06-23

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta SHIMAZAKI ,  Kosuke YONEZAKI ,  Hakaru HORIGUCHI ,  Kunimasa MISHIMA

IPC: B32B17/10 ,  B32B7/12 ,  B32B27/32 ,  B32B27/16 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00 ,  B32B38/10

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes ammonia and an acid or acid salt capable of forming a counterion to an ammonium ion.

公开(公告)号：US20220064494A1

公开(公告)日：2022-03-03

申请号：US17418390

申请日：2019-12-23

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke YONEZAKI ,  Hakaru HORIGUCHI ,  Yuta SHIMAZAKI

IPC: C09J7/38 ,  C09J7/24 ,  C03C23/00 ,  B32B17/10 ,  B32B27/30

Abstract: Provided is a method for preparing a PSA composition for protecting Low-E glass plates from degradation and corrosion. A PSA composition preparation method is provided for Low-E glass plate protection. The method comprises a step of obtaining an aqueous liquid, and a step of obtaining a polymer-containing liquid comprising the aqueous liquid and a polymer. Here, the aqueous liquid satisfies at least (a) having an electrical conductivity below 300 μS/cm or (b) having a chloride ion concentration below 35 μg/mL.

公开(公告)号：US20220063180A1

公开(公告)日：2022-03-03

申请号：US17418346

申请日：2019-12-23

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta SHIMAZAKI ,  Kosuke YONEZAKI ,  Hakaru HORIGUCHI

IPC: B29C63/02 ,  B29C63/04 ,  C09J7/38

Abstract: Provided is a Low-E glass plate protective sheet that can have protective properties for a Low-E glass plate as an object to be protected and can maintain good removability while preventing or inhibiting surface contamination of the object to be protected even when prolongedly adhered thereto. The Low-E glass plate protective sheet is provided. The protective sheet has a PSA layer. The PSA layer comprises at least 95% base polymer by weight.

公开(公告)号：US20220315484A1

公开(公告)日：2022-10-06

申请号：US17596663

申请日：2020-06-23

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta SHIMAZAKI ,  Kosuke YONEZAKI ,  Hakaru HORIGUCHI ,  Kunimasa MISHIMA

IPC: C03C17/36 ,  C09J7/38

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting alteration and erosion of Low-E layers. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a tin component. Here, the Low-E layer comprises a tin component. The protective sheet has a PSA layer. The PSA layer comprises a phosphorus compound having a P—OR group. Here, R is a hydrogen atom or an organic group.

公开(公告)号：US20230167335A1

公开(公告)日：2023-06-01

申请号：US17919968

申请日：2021-04-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta SHIMAZAKI ,  Kosuke YONEZAKI ,  Hakaru HORIGUCHI ,  Kunimasa MISHIMA

IPC: C09J7/38 ,  C09J11/04 ,  C09J11/06

CPC classification number: C09J7/38 ,  C09J11/04 ,  C09J11/06 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/502 ,  C09J2400/143

Abstract: To provide a method for protecting a Low-E glass plate, the method being capable of preventing or inhibiting alteration of Low-E layers. Provided is a Low-E glass plate protection method. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes an adsorbent capable of adsorbing ammonia.

公开(公告)号：US20230081331A1

公开(公告)日：2023-03-16

申请号：US17798458

申请日：2021-02-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hakaru HORIGUCHI ,  Kosuke YONEZAKI ,  Yuta SHIMAZAKI ,  Kunimasa MISHIMA

IPC: C09J7/38 ,  C09J7/22 ,  C09J7/20 ,  C09J11/04 ,  C09J107/00

Abstract: A pressure-sensitive adhesive sheet includes a resin film as a substrate and a pressure-sensitive adhesive layer provided on a first face of the substrate. In the pressure-sensitive adhesive sheet, a second face of the substrate is a release face, and the second face has a slip resistance value of 3.5 N or more. The pressure-sensitive adhesive sheet has a high-speed peel strength of 4.5 N/20 mm or higher, which is measured under conditions of a tensile speed of 30 m/min after 30 minutes of application to a stainless steel plate, and it has a difference between the maximum and minimum values of a self-backside adhesive strength of 1.5 N/20 mm or lower, which is measured under a condition of a tensile speed of 30 m/min.

公开(公告)号：US20220371304A1

公开(公告)日：2022-11-24

申请号：US17619879

申请日：2020-06-23

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta SHIMAZAKI ,  Kosuke YONEZAKI ,  Hakaru HORIGUCHI ,  Kunimasa MISHIMA

IPC: B32B17/10 ,  C23C14/08 ,  C23C14/18 ,  C23C14/35 ,  B32B27/36 ,  B32B7/12 ,  B32B37/12 ,  B32B37/18 ,  B32B43/00 ,  C03C17/34 ,  C09J5/00 ,  C09J7/32 ,  C09J7/38 ,  C09J11/04

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 μg ammonia per gram of PSA layer weight.

公开(公告)号：US20220098449A1

公开(公告)日：2022-03-31

申请号：US17418557

申请日：2019-12-23

Applicant: NITTO DENKO CORPORATION

Inventor： Yuta SHIMAZAKI ,  Kosuke YONEZAKI ,  Hakaru HORIGUCHI

IPC: C09J7/38 ,  C08F220/18 ,  C08F220/06 ,  C08K5/17 ,  C08K5/353

Abstract: Provided is a PSA sheet that can be used on a metal adherend because it has anti-metal-corrosive properties and can also maintain good removability while preventing or inhibiting adherend surface contamination even when prolongedly adhered to the adherend. A PSA sheet having a PSA layer is provided. The PSA layer comprises at least 95% base polymer by weight and has a chloride ion amount of less than 300 μg per gram of pressure-sensitive adhesive layer, determined by hot water extraction.

公开(公告)号：US20220064495A1

公开(公告)日：2022-03-03

申请号：US17418395

申请日：2019-12-23

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke YONEZAKI ,  Hakaru HORIGUCHI ,  Yuta SHIMAZAKI

IPC: C09J7/38 ,  C09J5/00 ,  C09J7/24 ,  C09J7/25 ,  B32B17/10 ,  B32B27/32 ,  B32B27/30 ,  B32B27/36 ,  C03C23/00

Abstract: Provided is a Low-E glass plate protective sheet having excellent long-term reliability. A Low-E glass plate protective sheet is provided. The protective sheet has a PSA layer. The PSA layer has a chloride ion amount of 105 μg or less per gram of PSA, determined by hot water extraction.

公开(公告)号：US20210114360A1

公开(公告)日：2021-04-22

申请号：US16497930

申请日：2018-03-28

Applicant: NITTO DENKO CORPORATION

Inventor： Masahiko WATANABE ,  Yuta SHIMAZAKI ,  Taichi WATANABE ,  Yusuke YAMAMOTO ,  Tomohiro KONTANI

IPC: B32B27/40 ,  B32B7/022 ,  B32B7/027 ,  B32B7/12

Abstract: The heat-shielding heat insulating substrate is a heat-shielding heat insulating substrate including a transparent substrate layer and an infrared reflection layer, the heat-shielding heat insulating substrate including: a protective topcoat layer arranged on a side of the infrared reflection layer opposite to the transparent substrate layer; and a protective film arranged on a surface of the protective topcoat layer opposite to the infrared reflection layer, wherein a 180° peel strength of the protective film to the protective topcoat layer under an environment having a temperature of 23±1° C. and a humidity of 50±5% RH is from 0.01 N/50 mm to 0.40 N/50 mm, and wherein a 180° peel strength of the protective film to the protective topcoat layer after storage of the heat-shielding heat insulating substrate under an environment having a temperature of 80±1° C. for 10 days is from 0.01 N/50 mm to 1.0 N/50 mm.