公开(公告)号：US20180169755A1

公开(公告)日：2018-06-21

申请号：US15735255

申请日：2016-06-08

申请人： NOF CORPORATION

发明人： Yasunobu TAGAMI ,  Naoshi TAKAHASHI ,  Masayuki SAITOH ,  Kouhei SAWADA

IPC分类号： B22F1/00 ,  H01B1/02

CPC分类号： B22F1/0062 ,  B22F1/00 ,  B22F1/02 ,  B22F2301/10 ,  H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00

摘要： There are provided a surface-coated copper filler having an excellent oxidation resistance for use in a conductive composition, a method for producing the surface-coated copper filler, and a conductive composition containing the surface-coated copper filler. The surface-coated copper filler comprises: a copper particle; a first coating layer containing an amine compound, which is bonded to copper on a surface of the copper particle via a chemical bond and/or a physical bond; and a second coating layer containing an aliphatic monocarboxylic acid having 8 to 20 carbon atoms, which is bonded to the amine compound via a chemical bond. The amine compound is represented by the following formula (1): H2NCH2mNHnCH2mNH2  (1) wherein m is an integer of 0 to 3, n is an integer of 0 to 2, m is 0 to 3 when n is 0, and m is 1 to 3 when n is 1 or 2.