公开(公告)号：US11439002B2

公开(公告)日：2022-09-06

申请号：US17081916

申请日：2020-10-27

Applicant: NVIDIA CORPORATION

Inventor： Mingyi Yu ,  Ananta H. Attaluri ,  Gregory Patrick Bodi ,  Carmen A. Capillo, Jr. ,  Michael James Warner

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/42

Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.