公开(公告)号：US11711905B2

公开(公告)日：2023-07-25

申请号：US16992035

申请日：2020-08-12

Applicant: NVIDIA CORPORATION

Inventor： Susheela Narasimhan ,  Michal L. Sabotta

IPC: H05K7/20

CPC classification number: H05K7/20163 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/20409

Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.