公开(公告)号：US20230129374A1

公开(公告)日：2023-04-27

申请号：US17509976

申请日：2021-10-25

Applicant: Nvidia Corporation

Inventor： Ryan Albright ,  Devarshi Patel ,  Chris Fox ,  Mark White ,  Rajeev Jayavant ,  Susheela Narasimhan ,  Kelly McArthur ,  Ben Watkins

IPC: H01R13/73

Abstract: Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.

公开(公告)号：US11523539B2

公开(公告)日：2022-12-06

申请号：US16857137

申请日：2020-04-23

Applicant: NVIDIA CORPORATION

Inventor： Nelson Au ,  Glenn Wernig ,  Jeongyong Jeon ,  Susheela Narasimhan

IPC: H05K7/20 ,  G06F1/20 ,  F28F27/00

Abstract: A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.

公开(公告)号：US20200217599A1

公开(公告)日：2020-07-09

申请号：US16555711

申请日：2019-08-29

Applicant: NVIDIA CORPORATION

Inventor： Susheela Narasimhan ,  Sanjay Choudhry

IPC: F28F3/08 ,  F28D1/047 ,  H05K7/20

Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.

公开(公告)号：US11990713B2

公开(公告)日：2024-05-21

申请号：US17509976

申请日：2021-10-25

Applicant: Nvidia Corporation

Inventor： Ryan Albright ,  Devarshi Patel ,  Chris Fox ,  Mark White ,  Rajeev Jayavant ,  Susheela Narasimhan ,  Kelly McArthur ,  Ben Watkins

IPC: H01R13/60 ,  H01R13/73

CPC classification number: H01R13/73

Abstract: Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.

公开(公告)号：US11828549B2

公开(公告)日：2023-11-28

申请号：US16555711

申请日：2019-08-29

Applicant: NVIDIA CORPORATION

Inventor： Susheela Narasimhan ,  Sanjay Choudhry

IPC: F28D15/02 ,  F28F3/08 ,  F28D1/047 ,  H05K7/20 ,  F28D21/00

CPC classification number: F28F3/086 ,  F28D1/0475 ,  F28D15/02 ,  F28D15/0275 ,  H05K7/20 ,  F28D2021/0029 ,  F28F2215/04

Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.

公开(公告)号：US11711905B2

公开(公告)日：2023-07-25

申请号：US16992035

申请日：2020-08-12

Applicant: NVIDIA CORPORATION

Inventor： Susheela Narasimhan ,  Michal L. Sabotta

IPC: H05K7/20

CPC classification number: H05K7/20163 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/20409

Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.