公开(公告)号：US20190229044A1

公开(公告)日：2019-07-25

申请号：US15878292

申请日：2018-01-23

Applicant: NXP B.V.

Inventor： AMORNTHEP SAIYAJITARA ,  Wiwat Tanwongwan ,  Chanon Suwankasab ,  Ekapong Tangpattanasaeree

IPC: H01L23/495 ,  H01L21/48

Abstract: A lead frame is formed with exposed lead tips. The leads are not attached at their tips to any of a tie bar, a dam bar or an end bar, so when the lead frame is plated, the lead tips are plated. During packaging, after die attach and molding, when the lead frame is cut from the frame assembly, the lead tips are not cut, so the plating remains on the tips. This improves solder joint reliability when the package is mounted on a PCB. The lead frame has connection bars that run parallel to the leads from the tie bar to the end bar. The connection bars provide stability to the leads during wire bonding, but are cut from the lead frame after wire bonding.