公开(公告)号：US20200273810A1

公开(公告)日：2020-08-27

申请号：US16283853

申请日：2019-02-25

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Amomthep Saiyaitara ,  Chanon Suwankasab ,  Russell Joseph Lynch

IPC: H01L23/552 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/528 ,  H01L23/49 ,  H01L23/495

Abstract: A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.