公开(公告)号：US20210202379A1

公开(公告)日：2021-07-01

申请号：US16731522

申请日：2019-12-31

Applicant: NXP B.V.

Inventor： Sven Trester ,  Tobias Richard Erich Nink

IPC: H01L23/522 ,  H01L23/528 ,  G06F30/39 ,  H01L21/50

Abstract: An integrated circuit includes functional structures and non-functional structures. The functional structures include one or more functional metal structures. The non-functional structures include one or more non-functional metal structures. At least one of the one or more non-functional metal structures is connected to at least one of the one or more functional metal structures. For example, the at least one non-functional metal structure is connected to the at least one functional metal structure through a via. Alternatively, the at least one non-functional metal structure is connected to the at least one functional metal structure by physically contacting the at least one functional metal structure without using a via.

公开(公告)号：US20240431021A1

公开(公告)日：2024-12-26

申请号：US18340985

申请日：2023-06-26

Applicant: NXP B.V.

Inventor： Lutz Pape ,  Nikita Veshchikov ,  Tobias Richard Erich Nink

IPC: H05K1/02 ,  G06F21/86

Abstract: A method is provided for detecting tampering of a printed circuit board (PCB) using a tamper detection circuit implemented in an integrated circuit (IC) mounted on the PCB. In the method, a reference signal is generated and provided to a terminal of the IC. The terminal is connected to another circuit mounted on the PCB. A first response signal is received in response to the reference signal at the terminal. One or more characteristics of the first response signal are stored in a memory. The reference signal is again provided to the terminal of the integrated circuit and a second response signal is received at the terminal. The stored characteristics of the first response signal are compared to corresponding characteristics of the second response signal to generate a comparison result. The comparison result is used to detect tampering. When tampering is detected, an indication is provided.

公开(公告)号：US11177210B2

公开(公告)日：2021-11-16

申请号：US16731522

申请日：2019-12-31

Applicant: NXP B.V.

Inventor： Sven Trester ,  Tobias Richard Erich Nink

IPC: H01L23/522 ,  H01L21/50 ,  G06F30/39 ,  H01L23/528

Abstract: An integrated circuit includes functional structures and non-functional structures. The functional structures include one or more functional metal structures. The non-functional structures include one or more non-functional metal structures. At least one of the one or more non-functional metal structures is connected to at least one of the one or more functional metal structures. For example, the at least one non-functional metal structure is connected to the at least one functional metal structure through a via. Alternatively, the at least one non-functional metal structure is connected to the at least one functional metal structure by physically contacting the at least one functional metal structure without using a via.