公开(公告)号：US20240071781A1

公开(公告)日：2024-02-29

申请号：US18263552

申请日：2022-01-27

Applicant: Nagase Chemtex Corporation

Inventor： Yosuke OI ,  Masahiro ASAHARA ,  Daisuke MORI

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121

Abstract: A method for sealing an electronic component mounting substrate including: preparing an electronic component mounting substrate including a substrate and electronic components mounted thereon and having a space between an electronic component and the substrate; placing a thermosetting sheet on the electronic component mounting substrate; and heat-molding the placed thermosetting sheet, to allow a melt of the thermosetting sheet to fill the space between the electronic component and the substrate and be cured. When a distance between the center of the substrate and an optional point P on a frame line that surrounds all the electronic components and minimizes the surrounded area is denoted by Lp, a distance Lq between the center of the substrate and a point Q at which a straight line passing through the point P and the center of the substrate intersects with an outer periphery of the thermosetting sheet is 0.9Lp or more.

公开(公告)号：US20220310546A1

公开(公告)日：2022-09-29

申请号：US17633598

申请日：2020-08-03

Applicant: Nagase ChemteX Corporation

Inventor： Daisuke MORI ,  Masahiro ASAHARA ,  Katsushi KAN ,  Eiichi NOMURA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56

Abstract: [Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention provides a multi-layer sheet for mold underfill encapsulation, which is characterized by having provided as an outermost layer thereof an (A) layer that comprises a resin composition having a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125° C. for a measurement time of 0-100 seconds.