公开(公告)号：US09795040B2

公开(公告)日：2017-10-17

申请号：US15130167

申请日：2016-04-15

申请人： Namics Corporation

发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC分类号： H05K3/38 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.