公开(公告)号：US20090027857A1

公开(公告)日：2009-01-29

申请号：US10585275

申请日：2005-03-29

申请人： Nancy F. Dean ,  Ignatius J. Rasiah

发明人： Nancy F. Dean ,  Ignatius J. Rasiah

IPC分类号： H05K7/20 ,  B23P6/00

CPC分类号： H01L23/3735 ,  H01L23/04 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/49353 ,  H01L2924/00

摘要： The invention includes a heat spreader having a base which has a perimeter surface surrounding a heat-receiving region. A frame portion interfaces the perimeter surface and has an opening traversing a thickness of the frame. The invention includes a method of forming a heat spreader construction by forming a base portion having a perimeter region surrounding a heat-receiving surface. An independent frame portion is joined to the base portion. The invention includes integrated circuitry having a heat spreader construction in thermal communication with a heat-generating device. The heat spreader has a base having a heat-receiving surface and a perimeter surface which interfaces a frame portion. The invention includes methodology for forming integrated circuitry which includes providing an integrated circuitry board having a heat generating device mounted thereon, and providing a multi-part heat spreader in thermal communication with the heat-generating device.

摘要翻译： 本发明包括具有基部的散热器，该基座具有围绕热接收区域的周边表面。 框架部分与周边表面相接合并且具有穿过框架厚度的开口。 本发明包括通过形成具有围绕热接收表面的周边区域的基部形成散热器结构的方法。 独立的框架部分连接到基部。 本发明包括具有与发热装置热连通的散热器结构的集成电路。 散热器具有基部，该基部具有与框架部分相接合的受热面和周边表面。 本发明包括用于形成集成电路的方法，其包括提供集成电路板，该电路板具有安装在其上的发热装置，并且提供与发热装置热连通的多部分散热器。

公开(公告)号：US07083850B2

公开(公告)日：2006-08-01

申请号：US10483370

申请日：2001-10-18

申请人： Ignatius J. Rasiah

发明人： Ignatius J. Rasiah

IPC分类号： B32B15/00 ,  H01L23/26

CPC分类号： H01L23/3737 ,  H01L2924/0002 ,  Y10T428/24997 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/31678 ,  H01L2924/00

摘要： A porous, flexible, resilient heat transfer material which comprises network of metal flakes. Such heat transfer materials are preferably produced by first forming a conductive paste comprising a volatile organic solvent and conductive metal flakes. The conductive paste is heated to a temperature below the melting point of the metal flakes, thereby evaporating the solvent and sintering the flakes only at their edges. The edges of the flakes are fused to the edges of adjacent flakes such that open pores are defined between at least some of the adjacent flakes, thereby forming a network of metal flakes. This network structure allows the heat transfer material to have a low storage modulus of less than about 10 GPa, while having good electrical resistance properties.

摘要翻译： 一种多孔，柔性，弹性的传热材料，其包括金属薄片网。 这种传热材料优选通过首先形成包含挥发性有机溶剂和导电金属薄片的导电糊来制备。 将导电糊加热到低于金属薄片的熔点的温度，从而蒸发溶剂并仅在其边缘烧结薄片。 薄片的边缘与相邻薄片的边缘熔合，使得在至少一些相邻的薄片之间限定开孔，从而形成金属薄片的网络。 该网络结构允许传热材料具有小于约10GPa的低储能模量，同时具有良好的电阻性能。