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公开(公告)号:US20210261405A1
公开(公告)日:2021-08-26
申请号:US17288536
申请日:2020-06-11
申请人: Nanjing University of Aeronautics and Astronautics , Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company
发明人: Zhendong DAI , Keju JI , Enhua CUI , Jian CHEN , Cong YUAN , Yiqiang TANG
IPC分类号: B81C1/00 , C09J183/04 , C09J133/08 , C09J109/00 , B81B1/00 , B81C99/00 , B29C33/38 , C25D7/00
摘要: A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.