利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

2 条记录 (耗时 0.012 秒)

    INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE
    2.
    发明申请
    INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE 有权
    用于将第一电子设备与第二电子设备电连接的互连结构

    公开(公告)号：US20150068024A1

    公开(公告)日：2015-03-12

    申请号：US14204694

    申请日：2014-03-11

    申请人： National Chiao Tung University

    发明人： Chun-Hsing Li ,  Chien-Nan Kuo ,  Chun-Lin Ko

    IPC分类号： H01P3/08

    CPC分类号： H01P5/02 ,  H01L23/64 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01P1/04 ,  H01P3/026 ,  H01P5/028 ,  Y10T29/49002 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.

    摘要翻译： 提供了用于将第一电子设备与第二电子设备电连接的互连结构。 第一电子器件具有两个第一接合焊盘，并且第二电子器件具有分别与两个第一接合焊盘电连接的两个第二接合焊盘。 互连结构包括电连接到两个第一接合焊盘和两个第二接合焊盘的信号传输结构; 以及设置在第一电子设备和第二电子设备之间的接地设备，使得第一电子设备和第二电子设备具有相同的接地电位。