公开(公告)号：US20230349763A1

公开(公告)日：2023-11-02

申请号：US17902578

申请日：2022-09-02

Applicant: National Tsing Hua University

Inventor： TaJen YEN ,  Wei-Cheng LIN ,  Fang Jing LEE

IPC: G01J3/44 ,  G01N21/65

CPC classification number: G01J3/4412 ,  G01N21/658

Abstract: A Raman detecting chip, a method of fabricating the same and a Raman spectroscopy detecting system using such Raman detecting chip are disclosed. The Raman detecting chip according to the invention includes a substrate, a plurality of nanowires and a plurality of three-dimensional dendritic metal nanostructures. The substrate has a recess. The recess has a circular opening and a circular bottom surface. The plurality of nanowires are formed on the circular bottom surface and protrude upwards. The plurality of three-dimensional dendritic metal nanostructures are formed on a plurality of tops of the plurality of nanowires and extend beyond the circular opening.