公开(公告)号：US11248967B2

公开(公告)日：2022-02-15

申请号：US16627917

申请日：2018-06-12

Applicant: New Degree Technology, LLC

Inventor： Hao Li ,  Zhiyun Chen

IPC: G01L1/18 ,  G01K7/16 ,  G06F3/041 ,  G01B7/16 ,  H01B1/20

Abstract: By combining at least two strain sensors in a symmetric configuration, a dual use sensor may be realized. This may reduce the footprint, cost, and complexity of employing two different sensors. It may also improve the accuracy of the measurements as two different parameters i.e., strain and environmental information are measured at the same physical location. This dual use sensor may be deployed in an array over a large area or space, providing systemic information of the subject that is previously difficult to detect.

公开(公告)号：US11796405B2

公开(公告)日：2023-10-24

申请号：US17205860

申请日：2021-03-18

Applicant: New Degree Technology, LLC

Inventor： Hao Li ,  Zhiyun Chen

IPC: G01L1/22 ,  H01L29/8605 ,  H01L49/02 ,  G01L1/14 ,  G01L1/18 ,  G06F3/041

CPC classification number: G01L1/2293 ,  G01L1/148 ,  G01L1/2262 ,  G01L1/2281 ,  H01L28/20 ,  H01L29/8605 ,  G01L1/18 ,  G06F3/041 ,  G06F2203/04105

Abstract: A hybrid strain sensing system and the method of making such a system provides a thin semiconductor film with strain sensors and signal processing circuits integrated deposited thereon. The semiconductor film may be further processed and then mounted onto a substrate to be used for strain, force, or other related measurements. The system combines the high sensitivity of a semiconductor strain gauge with the high level of integration of semiconductor integrated circuits (IC)s. Both are highly desirable features for applications where miniaturization and/or flexibility are important requirements.

公开(公告)号：US10908037B2

公开(公告)日：2021-02-02

申请号：US16002819

申请日：2018-06-07

Applicant: New Degree Technology, LLC

Inventor： Hao Li ,  Zhiyun Chen

IPC: G01L1/00 ,  G01L1/18 ,  G01L1/14 ,  G06F3/041 ,  G06F3/044

Abstract: Transparent nanocomposites may be used as force sensing materials, either as a transparent piezo-resistive material for resistive force sensing or a transparent dielectric material for capacitive force sensing. The common aspect of these nanocomposites is to engineer the refractive index of the binder to the index of the fillers so that when incorporated into a force sensor the nanocomposite films are optically transparent.