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公开(公告)号:US20240107904A1
公开(公告)日:2024-03-28
申请号:US18242423
申请日:2023-09-05
发明人: Hieu Nguyen , Ravi Velpula , Barsha Jain
CPC分类号: H10N70/883 , H10B63/80 , H10N70/841
摘要: A resistive random access memory (RRAM) device is provided, and includes a top electrode layer, a bottom electrode layer, and an insulating layer positioned between the top electrode layer and the bottom electrode layer. The insulating layer includes a SiNx layer.