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公开(公告)号：US10962427B2
公开(公告)日：2021-03-30
申请号：US16739687
申请日：2020-01-10
Applicant: NextInput, Inc.
Inventor： Mehrnaz Youssefi , Julius Minglin Tsai
Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
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公开(公告)号：US20200225100A1
公开(公告)日：2020-07-16
申请号：US16739687
申请日：2020-01-10
Applicant: NextInput, Inc.
Inventor： Mehrnaz Youssefi , Julius Minglin Tsai
Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
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