公开(公告)号：US4082621A

公开(公告)日：1978-04-04

申请号：US756158

申请日：1977-01-03

申请人： Nicholas J. Spiliotis ,  William R. Schevey ,  Donald W. Himler

发明人： Nicholas J. Spiliotis ,  William R. Schevey ,  Donald W. Himler

IPC分类号： C25D5/12 ,  C25D5/56

CPC分类号： C25D5/56 ,  C25D5/12 ,  Y10T428/12569 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12722

摘要： A nickel or cobalt layer is electroplated from a fluoborate bath directly onto a lead or lead alloy or tin or tin alloy sublayer, which has been electroplated onto a metal surface. Microcracked chrome is electroplated over the nickel or cobalt layer. With a nonconductive plastic substrate, the sublayer is electroplated onto a metal film which was deposited on the plastic by an electroless method. The plated product includes a sublayer of about 0.05 to 2 mils lead or lead alloy or tin or tin alloy, a second layer of about 0.05 to 2 mils nickel or cobalt, and an outer layer of about 0.001 to 1 mil chrome.

公开(公告)号：US4175011A

公开(公告)日：1979-11-20

申请号：US925085

申请日：1978-07-17

申请人： Nicholas J. Spiliotis

发明人： Nicholas J. Spiliotis

IPC分类号： C23F1/18 ,  H05K3/06 ,  C25D5/02 ,  C09K13/08 ,  C23F1/02

CPC分类号： C23F1/18 ,  H05K3/067

摘要： In printed circuit board manufacture, a copper pattern on the board is slightly etched and then a tin/lead layer is plated onto the etched copper pattern. The etching step is free of sulfate materials and includes etching the copper pattern with an aqueous solution of hydrogen peroxide and fluoboric acid.

摘要翻译： 在印刷电路板制造中，板上的铜图案被稍微蚀刻，然后将锡/铅层电镀到蚀刻的铜图案上。 蚀刻步骤不含硫酸盐材料，并且包括用过氧化氢和氟硼酸的水溶液蚀刻铜图案。