Fastening device for mounting thermal module to electronic component
    3.
    发明授权
    Fastening device for mounting thermal module to electronic component 有权
    用于将热模块安装到电子部件的紧固装置

    公开(公告)号:US07489510B1

    公开(公告)日:2009-02-10

    申请号:US11964905

    申请日:2007-12-27

    IPC分类号: H05K7/20 F28F7/00

    摘要: A thermal module includes a heat sink (400), a heat pipe (200) and a fastening device (300). The heat pipe (200) includes an evaporator (240) and a condenser (220) connected with the heat sink. The fastening device includes a base member (320) and a spring member (340). The base member includes a contacting plate (322) and two locating pins (324). Each locating pin includes a head portion (3240) and a neck portion (3244). The spring member includes a pressing portion (342) pressing the evaporator towards the contacting plate. Two locating holes (348) are defined in the pressing portion. The spring member is mounted on the base member via engagement of the locating holes with the locating pins. The spring member has a thickness smaller than a length of each of the neck portions and is movable along the neck portions to suit for a size of the evaporator.

    摘要翻译: 热模块包括散热器(400),热管(200)和紧固装置(300)。 热管(200)包括与散热器连接的蒸发器(240)和冷凝器(220)。 紧固装置包括基部构件(320)和弹簧构件(340)。 基座构件包括接触板(322)和两个定位销(324)。 每个定位销包括头部(3240)和颈部(3244)。 弹簧构件包括将蒸发器压向接触板的按压部分(342)。 两个定位孔(348)被限定在按压部分中。 弹簧构件通过定位孔与定位销的接合而安装在基座构件上。 弹簧构件的厚度小于每个颈部的长度,并且可以沿颈部移动以适合于蒸发器的尺寸。