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公开(公告)号：US20230250209A1
公开(公告)日：2023-08-10
申请号：US18014902
申请日：2021-06-30
IPC分类号： C08F279/00 , C09J151/00
CPC分类号： C08F279/00 , C09J151/003
摘要： A polymer compound represented by formula (1) in formula (1), R1 and R2 each independently represent a hydrogen atom or a methyl group. In formula (1), m and n are average numbers of repeating units, and each independently represent a real number within the range of 1 to 2000. The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent.
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公开(公告)号：US20240150512A1
公开(公告)日：2024-05-09
申请号：US18280597
申请日：2022-03-04
IPC分类号： C08F267/06 , C08J5/18 , C09J151/00
CPC分类号： C08F267/06 , C08J5/18 , C09J151/003 , C08J2351/00
摘要： The resin composition incudes a polymer compound represented by the formula (1), where in formula (1), R1 and R2 each independently represent a hydrogen atom or a methyl group, and m and n represent the average numbers of repeating units, and are each independently in the range between 1 and 2000 inclusive; a compound that can radically polymerize with the polymer compound; and a radical initiator. The compound that can radically polymerize with the polymer compound is at least one selected from the group consisting of phenylmaleimide compounds, acenaphthylene compounds, modified polyphenylene ether resins having an unsaturated double bond at an end, and aryl isocyanurate compounds.
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