公开(公告)号：US20230209721A1

公开(公告)日：2023-06-29

申请号：US18082894

申请日：2022-12-16

Applicant: Nitto Denko Corporation

Inventor： Shotaro NAGAOKA ,  Yuu SUGIMOTO

IPC: H05K3/18 ,  H05K3/26

CPC classification number: H05K3/188 ,  H05K3/26 ,  H05K2203/0723 ,  H05K2203/0789 ,  H05K2203/1484

Abstract: In a plating method, a laminate made of stainless steel, and copper or a copper alloy is prepared. Plating underlayers made of nickel are formed on a first plated portion provided at the stainless steel and a second plated portion provided at the copper or the copper alloy at the same time with use of a hydrochloric acid electrolytic solution.