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公开(公告)号：US4601423A
公开(公告)日：1986-07-22
申请号：US533262
申请日：1983-09-16
申请人： Noel J. Pipkin , Trevor P. Elworthy
发明人： Noel J. Pipkin , Trevor P. Elworthy
CPC分类号： C04B37/026 , B23K35/001 , B24D3/007 , B24D3/06 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/361 , C04B2237/401 , C04B2237/708
摘要： A cubic boron nitride compact is bonded to a cemented carbide support through an alloy bonding layer which contains 40 to 70 percent by weight silver, gold or a combination thereof and 1 to 10 percent by weight of a high melting metal selected from the group of titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium and molybdenum. Bonding may be achieved by first metallizing a surface of the cubic boron nitride compact with a layer of gold or silver or a gold or silver based alloy and then bonding the metallized layer to the carbide support by means of a braze alloy having a liquidus temperature above 700.degree. C.
摘要翻译： 立方氮化硼压块通过合金粘合层与硬质合金支架结合，该合金粘结层含有40-70％重量的银，金或其组合，和1-10％重量的选自钛的高熔点金属 锆，铪，钒，铌，钽，铬和钼。 可以通过首先用立方氮化硼压块的表面金属化金或银或金或银基合金来实现粘合，然后通过具有液相线温度的钎焊合金将金属化层粘合到碳化物支撑体上 700℃
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公开(公告)号：US5012345A
公开(公告)日：1991-04-30
申请号：US563739
申请日：1990-07-31
申请人： Trevor P. Elworthy
发明人： Trevor P. Elworthy
CPC分类号： G03F9/00
摘要： Apparatus and method for punching registration holes in exposed films having cooperating image areas, in which the films to be registered and punched are supported on a platform, punch means is mounted on the platform for punching registration holes in each film outside its image area, and electronic means is provided for producing an image, preferably, magnified, of at least one selected part of a film supported on the platform.
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