公开(公告)号：US11648620B2

公开(公告)日：2023-05-16

申请号：US16203562

申请日：2018-11-28

申请人： Watlow Electric Manufacturing Company

发明人： Brent Elliot ,  Guleid Hussen ,  Jason Stephens ,  Michael Parker ,  Alfred Grant Elliot

IPC分类号： B23K1/00 ,  B23B9/00 ,  C04B35/581 ,  B23K1/19 ,  B23K35/28 ,  C04B37/00 ,  H01L21/683 ,  H01L21/687 ,  B32B9/00 ,  H01L21/67 ,  B23K1/008 ,  C04B37/02 ,  B23K103/00

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/286 ,  B32B9/005 ,  C04B35/581 ,  C04B37/005 ,  C04B37/026 ,  H01L21/67126 ,  H01L21/6833 ,  H01L21/68757 ,  H01L21/68785 ,  H01L21/68792 ,  B23K2103/52 ,  C04B2235/6581 ,  C04B2237/123 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/68 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/80 ,  C04B2237/84

摘要： A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with Nickel and an alloying element, under controlled atmosphere. The completed joint will be fully or substantially Nickel with another element in solution. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck. Semiconductor processing equipment comprising ceramic and joined with a nickel alloy and adapted to withstand processing chemistries, such as fluorine chemistries, as well as high temperatures.

公开(公告)号：US20180346387A1

公开(公告)日：2018-12-06

申请号：US15778694

申请日：2016-11-08

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Nobuyuki Terasaki ,  Yoshiyuki Nagatomo

IPC分类号： C04B37/02 ,  H01L23/13 ,  H01L23/373 ,  H01L23/40 ,  H05K1/03 ,  H05K1/05

CPC分类号： C04B37/02 ,  B23K1/0016 ,  B23K35/0233 ,  B23K35/025 ,  B23K35/286 ,  B23K2103/10 ,  B23K2103/172 ,  B23K2103/52 ,  C04B35/584 ,  C04B35/645 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/96 ,  C04B2237/08 ,  C04B2237/121 ,  C04B2237/128 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/52 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C22C21/00 ,  C22C21/02 ,  C22C29/16 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/40 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/05

摘要： A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.

公开(公告)号：US20180216411A1

公开(公告)日：2018-08-02

申请号：US15745719

申请日：2016-07-20

申请人： SMITH INTERNATIONAL, INC.

发明人： John Daniel Belnap ,  Yi Fang ,  Michael David France ,  David P. DenBoer ,  Haibo Zhang

IPC分类号： E21B10/573 ,  E21B10/567 ,  C04B35/528 ,  C04B35/645 ,  C04B35/63 ,  C04B37/02 ,  C22C26/00 ,  C22C29/08 ,  B22F7/08

CPC分类号： E21B10/5735 ,  B22F7/062 ,  B22F7/08 ,  B22F2005/001 ,  B22F2302/10 ,  B22F2302/406 ,  C04B35/528 ,  C04B35/6303 ,  C04B35/645 ,  C04B37/023 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/442 ,  C04B2235/96 ,  C04B2237/086 ,  C04B2237/12 ,  C04B2237/363 ,  C04B2237/401 ,  C04B2237/704 ,  C04B2237/72 ,  C22C26/00 ,  C22C29/08 ,  E21B10/50 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/573

摘要： Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.

公开(公告)号：US10037928B2

公开(公告)日：2018-07-31

申请号：US15537684

申请日：2016-01-23

申请人： KYOCERA Corporation

发明人： Narutoshi Ogawa ,  Kensou Ochiai ,  Noritaka Niino ,  Shinichi Kooriyama ,  Masashi Konagai

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/14 ,  H01L23/473

CPC分类号： H01L23/367 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  C04B2237/86 ,  C04B2237/88 ,  H01L23/12 ,  H01L23/142 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49833 ,  H05K1/05 ,  H05K7/20 ,  H05K7/209

摘要： A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.

公开(公告)号：US20180190610A1

公开(公告)日：2018-07-05

申请号：US15740785

申请日：2016-06-22

申请人： OSRAM Opto Semiconductors GmbH

发明人： Mathias WENDT

IPC分类号： H01L23/00 ,  C04B37/00 ,  C03C27/08 ,  H01L33/08 ,  H01L33/62

CPC分类号： H01L24/29 ,  C03C27/08 ,  C04B37/003 ,  C04B37/005 ,  C04B37/006 ,  C04B37/025 ,  C04B37/026 ,  C04B37/04 ,  C04B2237/06 ,  C04B2237/12 ,  C04B2237/30 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/54 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  C23C14/086 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/62 ,  H01L2224/29187 ,  H01L2224/83896 ,  H01L2933/0066

摘要： The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.

公开(公告)号：US20180190568A1

公开(公告)日：2018-07-05

申请号：US15742829

申请日：2016-06-01

申请人： KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA MATERIALS CO., LTD.

发明人： Takayuki NABA ,  Hiromasa KATO ,  Noboru KITAMORI

IPC分类号： H01L23/373 ,  H01L23/15 ,  H01L23/492 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  C04B2237/88 ,  H01L21/4882 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/32245

摘要： The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate through respective bonding layers, wherein a metal film is provided on a surface of one metal plate bonded to one surface of the ceramic substrate; and at least a part of another metal plate bonded to another surface of the ceramic substrate is not provided with the metal film. Preferably, a protruding portion is formed as a portion of the bonding layer so as to protrude from a side surface of each of the metal plates. According to the above-described configuration, it is possible to provide a ceramic circuit board which is easy to use according to the parts to be bonded and is excellent in heat-cycle resistance characteristics.

公开(公告)号：US20180036696A1

公开(公告)日：2018-02-08

申请号：US15553667

申请日：2016-02-26

申请人： Element Six (UK) Limited

发明人： Nedret CAN ,  Sedigheh SALEHI

IPC分类号： B01J3/06 ,  E21B10/573 ,  C04B35/645 ,  C04B37/02 ,  C04B35/5831 ,  B32B18/00 ,  C04B35/528

CPC分类号： B01J3/062 ,  B01J2203/062 ,  B01J2203/0655 ,  B01J2203/0685 ,  B32B18/00 ,  C04B35/528 ,  C04B35/5831 ,  C04B35/645 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/427 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5472 ,  C04B2235/96 ,  C04B2237/064 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/401 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  E21B10/5735

摘要： A superhard polycrystalline construction (30) comprises a first region (34) comprising a body of thermally stable polycrystalline superhard material having an exposed surface forming a working surface (4), and a peripheral side edge (6), a second region (32) forming a substrate to the first region, and a third region (36) at least partially interposed between the first and second regions wherein the third region comprises a material more acid resistant than polycrystalline diamond material having a binder-catalyst phase comprising cobalt, and/or more acid resistant than cemented carbide material.

公开(公告)号：US09870902B2

公开(公告)日：2018-01-16

申请号：US14782969

申请日：2014-04-28

申请人： KOBELCO RESEARCH INSTITUTE, INC.

发明人： Yuichi Taketomi ,  Moriyoshi Kanamaru ,  Shintaro Yoshida

IPC分类号： C23C14/35 ,  H01J37/34 ,  C04B35/01 ,  C04B35/447 ,  C04B35/645 ,  C04B37/02 ,  C23C14/34 ,  C23C14/08

CPC分类号： H01J37/3417 ,  C04B35/01 ,  C04B35/447 ,  C04B35/645 ,  C04B37/026 ,  C04B2235/3203 ,  C04B2235/3275 ,  C04B2235/6565 ,  C04B2235/72 ,  C04B2235/721 ,  C04B2235/96 ,  C04B2235/963 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/402 ,  C04B2237/407 ,  C23C14/082 ,  C23C14/085 ,  C23C14/3407 ,  C23C14/3414 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/3491

摘要： Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.

公开(公告)号：US09863830B2

公开(公告)日：2018-01-09

申请号：US15303241

申请日：2014-12-18

申请人： Endress + Hauser GmbH + Co. KG

发明人： Ulfert Drewes ,  Elke Schmidt ,  Thomas Uehlin ,  Andrea Berlinger

IPC分类号： G01L9/00 ,  C04B37/02 ,  G01L13/02 ,  G01L19/00 ,  G01L19/06 ,  G01L19/04 ,  G01L19/14

CPC分类号： G01L9/0075 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/665 ,  C04B2237/04 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/127 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/40 ,  C04B2237/406 ,  C04B2237/58 ,  C04B2237/708 ,  C04B2237/72 ,  G01L9/0072 ,  G01L13/025 ,  G01L19/0007 ,  G01L19/0046 ,  G01L19/04 ,  G01L19/0681 ,  G01L19/14

摘要： A pressure sensor, including a platform of ceramic, a measuring membrane arranged on the platform, a pressure measuring chamber enclosed in the platform under the measuring membrane, and at least one metal body connected with the platform via a pressure-tight, preferably elastomer free, mechanical connection. Thermomechanical stresses arising from the connection are reduced by features including that the pressure-tight, mechanical connection occurs via an adapting body arranged between the platform and the metal body. The adapting body has a thermal expansion coefficient, which rises in direction (z) extending from the platform to the metal body from a coefficient of expansion corresponding to a thermal coefficient of expansion of the ceramic of the platform to a coefficient of expansion corresponding to the thermal coefficient of expansion of the metal body, and the adapting body is connected by a first joint with the platform and by a second joint with the metal body.

公开(公告)号：US20180002239A1

公开(公告)日：2018-01-04

申请号：US15706692

申请日：2017-09-16

申请人： IXYS Semiconductor GmbH

发明人： Heiko Knoll

IPC分类号： C04B37/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373

CPC分类号： C04B37/021 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/665 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A method of joining a metal-ceramic substrate having metalization on at least one side to a metal body by using a metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm, and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.