公开(公告)号：US20210025691A1

公开(公告)日：2021-01-28

申请号：US16969021

申请日：2019-02-20

Applicant: Nokia Technologies Oy

Inventor： Michael EGGLESTON ,  Mark EARNSHAW ,  Cristian BOLLE ,  Flavio PARDO

IPC: G01B9/02 ,  A61B5/00

Abstract: Examples of the disclosure relate to an apparatus (101), a wearable electronic device and an optical arrangement for optical coherence tomography. The apparatus comprises an optical coherence tomography system (103) and an optical arrangement (105). The optical arrangement comprises at least one means for beam shaping (109) configured to shape a beam of light from the optical coherence tomography system. The optical arrangement also comprises at least one minor (111) positioned so that light from the means for beam shaping is incident on the at least one minor. The at least one mirror is configured to move in at least one direction relative to the optical coherence tomography system.

公开(公告)号：US20250089212A1

公开(公告)日：2025-03-13

申请号：US18580789

申请日：2022-07-26

Applicant: Nokia Technologies Oy

Inventor： Raffaele Luca AMALFI ,  Stefano GRILLANDA ,  Ryan ENRIGHT ,  Cristian BOLLE ,  Mark EARNSHAW

IPC: H05K7/20

Abstract: Examples of the disclosure relate to apparatus for cooling components such as electronic circuitry components and photonic components. A first component and a second component are provided on the same surface of a substrate. At least one temperature control means, such as a thermoelectric cooler. is configured to control the temperature of at least one of the components. The apparatus also comprises a plurality of heat transfer means that extend through the substrate from the first surface to the second surface. The plurality of heat transfer means enable heat to be transferred from the components to a heat pipe provided on the second surface of the substrate. This enables heat to be transferred through the substrate and away from the components and so can reduce the amount of heat that spreads laterally across the substrate. This allows for efficient removal of heat from the components and reduces heat transfer between the components.