公开(公告)号：US20230024390A1

公开(公告)日：2023-01-26

申请号：US17863506

申请日：2022-07-13

Applicant: Nokia Technologies Oy

Inventor： Raffaele Luca AMALFI ,  Stefano GRILLANDA ,  Ryan ENRIGHT

IPC: H05K7/20

Abstract: An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.

公开(公告)号：US20240053108A1

公开(公告)日：2024-02-15

申请号：US18229229

申请日：2023-08-02

Applicant: Nokia Technologies Oy

Inventor： Ryan Enright ,  Raffaele Luca AMALFI ,  Stefano GRILLANDA

IPC: F28D15/02 ,  H05K7/20

CPC classification number: F28D15/0241 ,  H05K7/20336

Abstract: Examples of the disclosure relate to an apparatus. The apparatus comprises a housing portion and a flexible portion. The housing portion comprises one or more heat sources. The flexible portion is configured to be moved between a closed configuration and an open configuration wherein in the closed configuration the flexible portion is housed in the housing portion and in the open configuration the flexible portion is positioned outside of the housing. The flexible portion comprises a flexible display and an oscillating heat pipe. The oscillating heat pipe is coupled to the one or more heat sources in the housing portion. The oscillating heat pipe is flexible and configured to move with the flexible portion between the closed configuration and the open configuration. One or more condenser regions of the oscillating heat pipe are positioned in the flexible portion.

公开(公告)号：US20250089212A1

公开(公告)日：2025-03-13

申请号：US18580789

申请日：2022-07-26

Applicant: Nokia Technologies Oy

Inventor： Raffaele Luca AMALFI ,  Stefano GRILLANDA ,  Ryan ENRIGHT ,  Cristian BOLLE ,  Mark EARNSHAW

IPC: H05K7/20

Abstract: Examples of the disclosure relate to apparatus for cooling components such as electronic circuitry components and photonic components. A first component and a second component are provided on the same surface of a substrate. At least one temperature control means, such as a thermoelectric cooler. is configured to control the temperature of at least one of the components. The apparatus also comprises a plurality of heat transfer means that extend through the substrate from the first surface to the second surface. The plurality of heat transfer means enable heat to be transferred from the components to a heat pipe provided on the second surface of the substrate. This enables heat to be transferred through the substrate and away from the components and so can reduce the amount of heat that spreads laterally across the substrate. This allows for efficient removal of heat from the components and reduces heat transfer between the components.

公开(公告)号：US20230269909A1

公开(公告)日：2023-08-24

申请号：US18110958

申请日：2023-02-17

Applicant: Nokia Technologies Oy

Inventor： Stefano Grillanda ,  Raffaele Luca AMALFI ,  Ryan ENRIGHT

IPC: H05K7/20 ,  H01S5/024

CPC classification number: H05K7/20336 ,  H01S5/02438 ,  H01S5/02423 ,  G01S7/4814

Abstract: Examples of the disclosure relate to an oscillating heat pipe. The oscillating heat pipe includes a channel, a wick structure and a vent. The channel is configured to enable flow of working fluid between at least one condenser region and at least one evaporator region. The wick structure is in fluidic connection with the channel so as to enable working fluid to flow from the channel into the wick structure. The vent is configured to enable working fluid in an, at least partial, vapour phase to be returned from the wick structure to the channel.

公开(公告)号：US20220167529A1

公开(公告)日：2022-05-26

申请号：US17525012

申请日：2021-11-12

Applicant: Nokia Technologies Oy

Inventor： Ryan ENRIGHT ,  Raffaele Luca AMALFI

IPC: H05K7/20

Abstract: Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.