摘要:
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.
摘要:
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.
摘要:
A dispensing system for jetting a material onto a substrate is disclosed. The dispensing system includes a plate defining a first surface, a second surface opposite the first surface in a first direction, and at least one slot that extends through the plate from the first surface to the second surface, and an actuator assembly that contains a piezoelectric element and is operatively coupled to the needle. The dispensing system also includes at least one fastener that extends through the actuator assembly and the at least one slot, where the at least one fastener is configured to selectively engage the plate such that 1) in a disengaged configuration, the at least one fastener is movable within the slot and the actuator assembly is movable relative to the plate, and 2) in an engaged configuration, the at least one fastener is not movable within the slot and the actuator assembly is not movable relative to the plate such that a stroke length of the needle is adjusted.
摘要:
A dispensing system for jetting a material onto a substrate is disclosed. The dispensing system includes a plate defining a first surface, a second surface opposite the first surface in a first direction, and at least one slot that extends through the plate from the first surface to the second surface, and an actuator assembly that contains a piezoelectric element and is operatively coupled to the needle. The dispensing system also includes at least one fastener that extends through the actuator assembly and the at least one slot, where the at least one fastener is configured to selectively engage the plate such that 1) in a disengaged configuration, the at least one fastener is movable within the slot and the actuator assembly is movable relative to the plate, and 2) in an engaged configuration, the at least one fastener is not movable within the slot and the actuator assembly is not movable relative to the plate such that a stroke length of the needle is adjusted.
摘要:
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature.
摘要:
An adhesive dispensing module includes a pneumatic actuator for actuating reciprocating movement of a piston on a dispenser valve member. The pneumatic actuator includes a valve element and a pneumatic housing with an inlet chamber, an exhaust chamber, and a piston chamber. The valve element includes a plurality of inlet passages and a plurality of exhaust passages. The valve element rotates from a first position in which the inlet passages deliver pressurized air from the inlet chamber to the piston chamber, to a second position in which the exhaust passages exhaust pressurized air from the piston chamber to the exhaust chamber. The valve element also includes a plurality of fins configured to be driven by an electromagnetic coil to move the valve element.
摘要:
A jetting dispensing module includes a module body with a fluid bore. A nozzle element is coupled to the module body. The nozzle element includes a fluid reservoir communicating with the fluid bore of the module body and a dispensing passage. A guide element includes a main guide bore and an internal fluid space in fluid communication with the fluid bore. A plunger is mounted for reciprocating movement within the module body. The plunger extends through the main guide bore and into the internal fluid space, and includes a distal end moveable between a fully retracted position spaced from the fluid reservoir and a fully extended position within the fluid reservoir but out of contact with the nozzle element.
摘要:
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature.