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公开(公告)号：US12082344B2
公开(公告)日：2024-09-03
申请号：US17420402
申请日：2019-12-19
申请人： JABIL INC.
发明人： Mark Tudman , Rayce Loftin
CPC分类号： H05K13/0469 , B05B13/0431 , B05B13/0447 , F24H3/022 , H05B1/023 , H05B6/10 , H05B6/44
摘要： An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.
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公开(公告)号：US20240191995A1
公开(公告)日：2024-06-13
申请号：US18063124
申请日：2022-12-08
发明人： Andrew B. Sabater
CPC分类号： G01C19/5776 , G01C25/005 , G01K7/18 , G01K7/22 , G05D23/24 , H05B1/023
摘要： A nonlinear frequency modulated gyroscope includes a degenerate-mode mechanical resonator, positive feedback circuits, a temperature control component, and a gyroscope controller. The degenerate-mode mechanical resonator with two or more modes are coupled via a Coriolis effect. The positive feedback circuits for each mode of the degenerate-mode mechanical resonator include an analog or digital automatic gain control that maintains oscillations of each mode at a constant amplitude. The temperature control component includes a sensor and heating elements. The gyroscope controller is an application-specific integrated circuit, a field programmable gate array, or microcontroller. The degenerate-mode mechanical resonator, the positive feedback circuits, and the temperature control component are subsystems of the nonlinear frequency modulated gyroscope.
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公开(公告)号：US12009244B2
公开(公告)日：2024-06-11
申请号：US16741330
申请日：2020-01-13
发明人： Vijay D. Parkhe , Steven E. Babayan , Konstantin Makhratchev , Zhiqiang Guo , Phillip R. Sommer , Dan A. Marohl
IPC分类号： H01L21/683 , H01L21/67 , H05B1/02 , H05B3/02
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/67248 , H01L21/6831 , H05B1/023 , H05B1/0233 , H05B3/02
摘要： Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.
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公开(公告)号：US11947200B2
公开(公告)日：2024-04-02
申请号：US17039023
申请日：2020-09-30
发明人： Quazi Ikram , Ronald Scott Karfelt , Steven Nguyen , Nicholas Karfelt , Saman Jafarlou , Swetha Babu
CPC分类号： G02F1/0121 , G02F1/0147 , G02F1/225 , H05B1/023 , H05B3/06 , G02F2203/50 , H03M1/1205
摘要： The present disclosure relates to optical phase modulation devices. The optical phase modulation devices may include a heater resistance which induces a phase change and control systems and methods of controlling the induced phase change.
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公开(公告)号：US11906543B2
公开(公告)日：2024-02-20
申请号：US17965849
申请日：2022-10-14
发明人： Shoyeb Khan
CPC分类号： G01P21/025 , G01P5/165 , G08B21/182 , H05B1/023
摘要： Provided are embodiments including a system for performing health monitoring. The system includes a measurement device configured to measure pressure of an environment, a heating element of the heater section coupled to the measurement device, a first sensing element operably coupled to a first region of the measurement device, and a second sensing element operably coupled to a second region of the measurement device. The system also includes a programmable logic that is configured to generate a status signal or flag based at least in part on conditions of the first region or the second region of the measurement device, a processing system configured to control the heating element responsive to reaching a threshold temperature, and a display configured to display a status of the first region or second region of the measurement device based at least in part on the status signal or flag.
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公开(公告)号：US11898992B2
公开(公告)日：2024-02-13
申请号：US17933988
申请日：2022-09-21
申请人： Cornell University
发明人： Amit Lal , Mamdouh Abdelmejeed , Justin Kuo
CPC分类号： G01N29/07 , G01K11/22 , G01N29/2437 , G01N33/24 , G10K11/28 , H05B1/023 , G01N2291/011 , G01N2291/0231 , G01N2291/02881 , G01N2291/044 , G01N2291/106
摘要： Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.
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公开(公告)号：US20230417708A1
公开(公告)日：2023-12-28
申请号：US17933988
申请日：2022-09-21
申请人： Cornell University
发明人： Amit LAL , Mamdouh ABDELMEJEED , Justin KUO
CPC分类号： G01N29/07 , G01K11/22 , G01N29/2437 , G01N33/24 , G10K11/28 , G01N2291/106 , G01N2291/011 , G01N2291/0231 , G01N2291/02881 , G01N2291/044 , H05B1/023
摘要： Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.
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公开(公告)号：US20230393189A1
公开(公告)日：2023-12-07
申请号：US18325358
申请日：2023-05-30
发明人： Takuro Ashizawa , Hirotaka Sasaki , Keisuke Nitta
CPC分类号： G01R31/2875 , H05B1/023 , G05D23/1917 , H05B2203/007
摘要： A heater drive controlling apparatus for an electronic component testing apparatus includes a breaker disposed between a power source and heaters, and a controller that controls electric currents supplied from the power source to the heaters in order according to a first priority set for the heaters such that a sum of the supplied electric currents is within a rated current of the breaker. The electronic component testing apparatus includes a test chamber, a thermal-stress applying chamber, and a thermal-stress removing chamber each of which includes the heaters.
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公开(公告)号：US20230371131A1
公开(公告)日：2023-11-16
申请号：US18030016
申请日：2022-06-27
发明人： Heeyoung So , Jin Soo Lee , Youngsoo Lee , Hong Ju Hwang , Taemin Hwang , Dongyeon Keum
IPC分类号： H05B3/00 , H01M10/04 , H05B1/02 , H01M10/654
CPC分类号： H05B3/0038 , H01M10/0404 , H01M10/654 , H05B1/023 , H05B2203/032
摘要： One aspect of the present disclosure relates to a secondary battery lamination device, and more particularly, the secondary battery lamination device includes an infrared LED heat source portion including a plurality of individually controllable infrared LED lamps and a pressurizing portion, thereby manufacturing a battery with improved uniformity of adhesive strength and air permeability between the positive electrode, the separator, and the negative electrode.
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公开(公告)号：US11812522B2
公开(公告)日：2023-11-07
申请号：US16639551
申请日：2019-01-22
申请人： OMRON Corporation
CPC分类号： H05B1/02 , G05D23/00 , G05D23/1902 , G05B6/02 , H05B1/023 , H05B2203/035
摘要： A heating device (100) comprises: a heater (10) for heating an item (1); a temperature detection unit (20) for detecting the temperature of the item (1); and a temperature adjustment unit (30) for controlling the heater (10) on the basis of a target temperature and the detected value of the temperature detection unit (20) so that the temperature of the item (1) reaches the target temperature. The heating device (100) determines, as a system gain change rate, the rate of change from the initial value of a system gain determined as a ratio of a temperature increase value of the item (1) with respect to electric power inputted to the heater (10), and determines the rate of change in the heat retention of the item (1) using the system gain change rate.
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