公开(公告)号：US20190057938A1

公开(公告)日：2019-02-21

申请号：US15680202

申请日：2017-08-17

Applicant: Novatek Microelectronics Corp.

Inventor： Wei-Kuo Mai ,  Chiao-Ling Huang

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/00 ,  H01L23/544 ,  H05K1/14 ,  H01L23/498

Abstract: A chip on glass package assembly includes a glass substrate, a first type chip, a second type chip and a plurality of connecting lines. The glass substrate includes an active area and a peripheral area connected to the active area. The first type chip is mounted on the peripheral area and including a processor. The second type chip is mounted on the peripheral area and located on a side of the first type chip, wherein the second type chip is different from the first type chip. The connecting lines are disposed on the peripheral area and connecting the first type chip and the second type chip.

公开(公告)号：US10692815B2

公开(公告)日：2020-06-23

申请号：US15680202

申请日：2017-08-17

Applicant: Novatek Microelectronics Corp.

Inventor： Wei-Kuo Mai ,  Chiao-Ling Huang

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/544 ,  H01L23/498 ,  H05K1/14 ,  H01L25/18

Abstract: A chip on glass package assembly includes a glass substrate, a first type chip, a second type chip and a plurality of connecting lines. The glass substrate includes an active area and a peripheral area connected to the active area. The first type chip is mounted on the peripheral area and including a processor. The second type chip is mounted on the peripheral area and located on a side of the first type chip, wherein the second type chip is different from the first type chip. The connecting lines are disposed on the peripheral area and connecting the first type chip and the second type chip.