公开(公告)号：US20240250226A1

公开(公告)日：2024-07-25

申请号：US18099811

申请日：2023-01-20

Applicant: Nthdegree Technologies Worldwide Inc.

Inventor： William J Ray ,  Brian D Ogonowsky

IPC: H01L33/62

CPC classification number: H01L33/62

Abstract: Thin, flexible substrates have printed components or conductors on them forming planarized circuit layers. One or more of the circuits may be programmable, such as with a patterned printed conductive layer, so that one generic design may be used for many different types of functions. Instead of metal vias communicating vertically between the layers, the generic layers have one or more LEDs and photodiodes that generally face each other and communicate by light pulses. Near field communications may also be used for the vertical communications. This allows the separate layers to be combined in various ways, depending on the desired function of the overall product, without requiring the steps of forming holes, filling the holes with a metal, and then connecting the metal vias together, which may form unreliable connections when the layers are flexed. The input/output signals may also be by light or NFC.