公开(公告)号：US12150284B2

公开(公告)日：2024-11-19

申请号：US17704678

申请日：2022-03-25

Applicant: Nvidia Corporation

Inventor： Susheela Nanjunda Rao Narasimhan ,  Mohammad Amin Nabian ,  Oliver Hennigh ,  Sanjay Choudhry ,  Kaustubh Mahesh Tangsali

IPC: F24H3/00 ,  H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.

公开(公告)号：US20230309272A1

公开(公告)日：2023-09-28

申请号：US17704678

申请日：2022-03-25

Applicant: Nvidia Corporation

Inventor： Susheela Nanjunda Rao Narasimhan ,  Mohammad Amin Nabian ,  Oliver Hennigh ,  Sanjay Choudhry ,  Kaustubh Mahesh Tangsali

IPC: H05K7/20

CPC classification number: H05K7/20827 ,  H05K7/20836 ,  H05K7/20409

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.