公开(公告)号：US20230337402A1

公开(公告)日：2023-10-19

申请号：US17722103

申请日：2022-04-15

申请人： Nvidia Corporation

发明人： Marc E. Davis

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  H05K7/20763 ,  H05K7/20754

摘要： Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a server tray or box includes a surface with a flow-through fixture or manifold that extends on both sides of the surface, that includes an inward coupling, an outward coupling, a flow controller, and a state sensor, the state sensor to monitor a flow-through fixture or manifold, where a flow controller of a flow-through fixture or manifold can change a flow of a coolant through a flow-through fixture or manifold and can selectively trap a portion of a coolant within a flow-through fixture or manifold.

公开(公告)号：US12089378B2

公开(公告)日：2024-09-10

申请号：US17722103

申请日：2022-04-15

申请人： Nvidia Corporation

发明人： Marc E. Davis

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  H05K7/20754 ,  H05K7/20763

摘要： Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a server tray or box includes a surface with a flow-through fixture or manifold that extends on both sides of the surface, that includes an inward coupling, an outward coupling, a flow controller, and a state sensor, the state sensor to monitor a flow-through fixture or manifold, where a flow controller of a flow-through fixture or manifold can change a flow of a coolant through a flow-through fixture or manifold and can selectively trap a portion of a coolant within a flow-through fixture or manifold.