公开(公告)号：US20220336430A1

公开(公告)日：2022-10-20

申请号：US17591084

申请日：2022-02-02

Applicant: Nvidia Corporation

Inventor： Naly Guo ,  Jerry Jia ,  Xiuzhuang Yang ,  Cindy Cui

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L49/02

Abstract: IC package including a substrate having a first surface, a circuit die coupled to the first surface of the substrate, a decoupling capacitor coupled to the first surface of the substrate and a power trace coupled to the first surface of the substrate and connected to the circuit die and to the decoupling capacitor. A method of manufacturing an IC package include providing a substrate providing a substrate having a first surface, forming a power trace on the first surface of the substrate, mounting a circuit die on the first surface, where the circuit die is electrically connected to the power trace and mounting a decoupling capacitor on the first surface of the substrate, where the decoupling capacitor is electrically connected to the power trace and to the circuit die.