Abstract:
The invention relates to a hot melt inkjet ink composition, the hot melt inkjet ink composition being solid at room temperature and liquid at an elevated temperature, the hot melt inkjet ink composition comprising an acidic resin and a crystalline material. The invention relates further to the use of the hot melt inkjet ink composition as an etch resist and to a process for preparing an electrically conductive circuit on a support layer using the hot melt inkjet ink composition.
Abstract:
The invention relates to a latex ink composition, the latex ink composition comprising a water soluble resin. The invention further relates to a water soluble resin suitable for a latex ink composition, the water soluble resin comprising a backbone and a stabilizing group, wherein the stabilizing group is capable of forming hydrogen bonds. The invention further relates to the use of a water soluble resin in a latex ink composition.