ELECTRONIC CIRCUIT UNIT, IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE

    公开(公告)号:US20190038117A1

    公开(公告)日:2019-02-07

    申请号:US16158516

    申请日:2018-10-12

    Abstract: A disclosed electronic circuit unit includes a first circuit board in which first electrode pads, mounting lands and second electrode pads are formed and that has vias and wirings; a second circuit board in which third electrode pads and dummy pads are formed and that has vias and wirings; and electronic components that are connected to the mounting lands. When the dummy pads are projected in the direction orthogonal to a surface, one of the dummy pads is overlapped one of electrodes of one of the electronic components. The mounting lands for the electronic components overlapping the dummy pads at the time of the projection are connected to, by connecting members, the second electrode pads, the wirings, and the like, the dummy pads connected to the third electrode pads by the wirings or the like.

Patent Agency Ranking