公开(公告)号：US20210307590A1

公开(公告)日：2021-10-07

申请号：US17347770

申请日：2021-06-15

Applicant: OLYMPUS CORPORATION

Inventor： Sumio WAKITO ,  Masayoshi MIURA ,  Satoru ADACHI ,  Hiroyuki MOTOHARA ,  Shigeru HOSOKAI

IPC: A61B1/00

Abstract: An endoscope distal end structure includes: an imager, a distal end frame that is a three-dimensional molded interconnect device including a housing portion and a cable connecting portion, the cable connecting portion including a cable connection electrode, the housing portion being formed by cutting out at least a part of an outer peripheral portion of the distal end frame, the housing portion having a bottom surface on which connection terminals are formed, and a first side surface and a second side surface which are continuous to each other and on which a ground pattern is formed, a through hole having electrical conductivity, the through hole penetrating from the bottom surface to the cable connecting portion, and an electrical conductive pattern connecting a cable connection electrode and the ground pattern, the electrical conductive pattern being arranged on a side surface of the distal end frame.

公开(公告)号：US20210006690A1

公开(公告)日：2021-01-07

申请号：US17028336

申请日：2020-09-22

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA

IPC: H04N5/225 ,  H05K1/11 ,  H05K1/14 ,  A61B1/05

Abstract: An imaging unit includes: a semiconductor package including an optical system, an imaging sensor, and connection terminals; a rigid substrate including first connection lands respectively connected to the connection terminals; and an electronic component mount region including second connection lands on which a capacitor is mounted, and an inner lead mount region including third connection lands; and a flexible printed board including inner leads extended from one end of the flexible printed board in a bent manner and respectively connected to the third connection leads in the inner lead mount region; and cable connection leads arranged on another end of the flexible printed board and respectively connected to the inner leads. The rigid substrate and the flexible printed board are arranged in a projection plane in an optical axis direction of the semiconductor package. The third connection lands are arranged along one side of the rigid substrate.

公开(公告)号：US20190038117A1

公开(公告)日：2019-02-07

申请号：US16158516

申请日：2018-10-12

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA ,  Kazuki KAWACHI

IPC: A61B1/05 ,  A61B1/00 ,  H04N5/225

Abstract: A disclosed electronic circuit unit includes a first circuit board in which first electrode pads, mounting lands and second electrode pads are formed and that has vias and wirings; a second circuit board in which third electrode pads and dummy pads are formed and that has vias and wirings; and electronic components that are connected to the mounting lands. When the dummy pads are projected in the direction orthogonal to a surface, one of the dummy pads is overlapped one of electrodes of one of the electronic components. The mounting lands for the electronic components overlapping the dummy pads at the time of the projection are connected to, by connecting members, the second electrode pads, the wirings, and the like, the dummy pads connected to the third electrode pads by the wirings or the like.

公开(公告)号：US20140361153A1

公开(公告)日：2014-12-11

申请号：US14466246

申请日：2014-08-22

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA

IPC: G02B6/42 ,  G01J1/04 ,  G01J1/02

CPC classification number: G02B6/4245 ,  G01J1/0219 ,  G01J1/0425 ,  G02B6/4202 ,  G02B6/4239 ,  G02B6/4253 ,  G02B6/4257 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01S5/02228 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/183

Abstract: A photoelectric conversion module includes: a substrate having a wiring layer and a through hole; a photoelectric conversion element having a light emitting unit or light receiving unit and mounted on the substrate such that the light emitting unit or light receiving unit faces the through hole; a protruding portion that has a hole portion communicating with the through hole, and protrudes from one of principal surfaces of one of the substrate and the photoelectric conversion element, one of the principal surfaces facing the other one of the substrate and the photoelectric conversion element; and an adhesive that is filled in a part of a region between the substrate and the photoelectric conversion element, the region being a region outside an inner peripheral surface of the hole portion, and that bonds the substrate to the photoelectric conversion element.

Abstract translation: 光电转换模块包括：具有布线层和通孔的基板; 光电转换元件，其具有发光单元或光接收单元，并且安装在所述基板上，使得所述发光单元或光接收单元面向所述通孔; 所述突出部具有与所述通孔连通的孔部，从所述基板和所述光电转换元件的一方的一个主面突出，所述主面中的一个面朝向所述基板和所述光电转换元件中的另一个; 以及填充在基板和光电转换元件之间的区域的一部分中的粘合剂，该区域是在孔部的内周面的外侧的区域，并且将基板粘合到光电转换元件。

公开(公告)号：US20220022733A1

公开(公告)日：2022-01-27

申请号：US17495204

申请日：2021-10-06

Applicant: OLYMPUS CORPORATION

Inventor： Takuro HORIBE ,  Hiroyuki MOTOHARA ,  Kenjiro KANNO

IPC: A61B1/00 ,  A61B1/05

Abstract: A distal end unit for endoscope is provided in a distal end portion of an insertion portion and includes: an electronic module including an optical system and an electrode; a substrate including a connection portion electrically connected to the electrode of the electronic module, and including a connection land on which an electronic component is mounted; a holding member holding the electronic module and the substrate connected to the electrode; and a distal end frame body made of resin, on which the electronic module, the substrate and the holding member are integrally mounted via insert molding by loading the holding member holding the electronic module and the substrate in a mold such that an entrance surface of the optical system is exposed at an outer surface of the distal end frame body and the connection portion extends to a proximal end side.

公开(公告)号：US20210401267A1

公开(公告)日：2021-12-30

申请号：US17475925

申请日：2021-09-15

Applicant: OLYMPUS CORPORATION

Inventor： Daichi KODAMA ,  Tomokazu YAMASHITA ,  Takuro HORIBE ,  Hiroyuki MOTOHARA

IPC: A61B1/00

Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.

公开(公告)号：US20180125335A1

公开(公告)日：2018-05-10

申请号：US15860884

申请日：2018-01-03

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA ,  Yasuhiro KUSANO

IPC: A61B1/00 ,  A61B1/06 ,  A61B1/04

CPC classification number: A61B1/00096 ,  A61B1/00006 ,  A61B1/00009 ,  A61B1/00045 ,  A61B1/00105 ,  A61B1/0011 ,  A61B1/005 ,  A61B1/04 ,  A61B1/051 ,  A61B1/06 ,  G02B23/24 ,  G02B23/26 ,  H01L27/14 ,  H01L27/14618 ,  H04N5/2251 ,  H04N5/2253 ,  H04N2005/2255

Abstract: An imaging unit includes: an optical system; a semiconductor package including an image sensor, and a connection electrode formed on a back surface; a cable; an electronic component; and a multi-layer substrate having a rectangular plate shape and including: a first electrode and a second electrode arranged side-by-side with each other on a front surface, the semiconductor package being mounted on the first electrode, and the cable being connected to the second electrode; and a third electrode on a back surface, the electronic component being mounted on the third electrode. The multi-layer substrate includes walls on at least two opposing sides of the back surface, and the semiconductor package is disposed such that a light receiving surface of the image sensor is arranged horizontally with respect to the multi-layer substrate.

公开(公告)号：US20150098237A1

公开(公告)日：2015-04-09

申请号：US14571986

申请日：2014-12-16

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA

IPC: F21V8/00

CPC classification number: G02B6/0006 ,  G02B6/4202 ,  G02B6/423 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01S5/02284 ,  H01S5/183

Abstract: An optical fiber cable connecting structure includes: a substrate having a through hole; an optical element on a first surface of the substrate and having a light emitting unit such that the light emitting unit faces the substrate; an optical fiber cable on a second surface of the substrate opposite to the first surface, an end face of the optical fiber cable on a substrate side being covered with a jacket; a guide positioning part that has an insertion hole into which the optical fiber cable is inserted, and is configured to position the optical fiber cable and the optical element; and an abutting part that has a taper-shaped opening and is configured to position the optical element and the optical fiber cable so as to be separated by a specified distance by fixing an outer periphery of the end face of the optical fiber cable by the opening.

Abstract translation: 光缆连接结构包括：具有通孔的基板; 在所述基板的第一表面上的光学元件，并且具有发光单元，使得所述发光单元面向所述基板; 在所述基板的与所述第一表面相对的第二表面上的光纤电缆，所述光纤电缆在基板侧的端面被外套覆盖; 引导定位部，其具有插入所述光纤电缆的插入孔，并且被配置为定位所述光纤电缆和所述光学元件; 以及抵接部，其具有锥形开口，并且被配置成通过将光纤电缆的端面的外周固定在开口部上而将光学元件和光纤电缆定位成分开一定距离 。

公开(公告)号：US20230000327A1

公开(公告)日：2023-01-05

申请号：US17939287

申请日：2022-09-07

Applicant: OLYMPUS CORPORATION

Inventor： Hiroyuki MOTOHARA ,  Daichi KODAMA

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/005

Abstract: An endoscope includes an imager unit loading region provided on a distal end side of a distal end barrel member provided at a distal end portion of an insertion portion and formed of a resin material, a cable connection surface provided on a proximal end side, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface, a contact pattern formed on a wall surface, a wiring pattern formed on a front surface of the cable connection surface from the wall, and configured to electrically continue to the contact pattern, and a connection pattern formed on the cable connection surface, and configured to electrically continue to the wiring pattern, with a core wire of a cable being electrically connected to the connection pattern, in a space formed in the distal end portion by the cable connection surface.

公开(公告)号：US20200337539A1

公开(公告)日：2020-10-29

申请号：US16925468

申请日：2020-07-10

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro SHIMOHATA ,  Kensuke SUGA ,  Hiroyuki MOTOHARA

IPC: A61B1/05 ,  A61B1/00 ,  H01L27/146

Abstract: An image pickup apparatus disposed in an endoscope includes: an image pickup unit including an image pickup device, a stacked element and a plurality of rear electrodes; an interposer having a recessed portion in which the image pickup unit is housed, wherein a plurality of connection electrodes which are connected with the plurality of rear electrodes are disposed on a bottom surface of the recessed portion, and a plurality of bonding electrodes which are connected with the plurality of connection electrodes are disposed on an outer surface of the interposer; a sealing resin; and a plurality of electric cables connected to the plurality of bonding electrodes of the interposer. An arrangement interval between the plurality of bonding electrodes is set larger than an arrangement interval between the plurality of connection electrodes.