公开(公告)号：US20210313386A1

公开(公告)日：2021-10-07

申请号：US17341892

申请日：2021-06-08

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO

IPC: H01L27/146 ,  H01L21/66

Abstract: A manufacturing method of an image pickup apparatus includes: fabricating a plurality of image pickup members each having a light-receiving surface on which a transparent plate is disposed and a plurality of spacers; measuring thicknesses of the transparent plates and the spacers; classifying the image pickup members into first groups depending on the thicknesses of the transparent plates; classifying the spacers into second groups depending on the thicknesses, selecting a combination of any one of the first groups and any one of the second groups such that a sum of the thickness of each of the transparent plates and the thickness of each of the spacers is within a predetermined range with a focusing length of optical members as a center; fabricating stacked bodies by stacking the image pickup members and the spacers in the selected combination; and disposing the optical members on the spacers in the stacked bodies.

公开(公告)号：US20200344386A1

公开(公告)日：2020-10-29

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takatoshi IGARASHI ,  Takuro SUYAMA ,  Kazuhiro YOSHIDA ,  Kensuke SUGA

IPC: H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

公开(公告)号：US20220368816A1

公开(公告)日：2022-11-17

申请号：US17868929

申请日：2022-07-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Ken YAMAMOTO ,  Takatoshi IGARASHI

IPC: H04N5/225 ,  A61B1/05

Abstract: An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.

公开(公告)号：US20190260917A1

公开(公告)日：2019-08-22

申请号：US16403782

申请日：2019-05-06

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takuro SUYAMA ,  Takahiro SHIMOHATA ,  Takatoshi IGARASHI ,  Hiroshi KOBAYASHI

IPC: H04N5/225 ,  A61B1/05 ,  H01L27/146

Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

公开(公告)号：US20190113738A1

公开(公告)日：2019-04-18

申请号：US16214228

申请日：2018-12-10

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO

IPC: G02B23/24 ,  A61B1/00 ,  B29D11/00

Abstract: A manufacturing method of an optical unit for endoscope includes: a process of crimping a bonding sheet including a curable resin film to a release substrate having a release surface which is an optical flat surface; a mirror-finishing process of performing a partial curing treatment on a predetermined region of the bonding sheet to process the predetermined region into an optical flat surface; a process of fabricating a laminated wafer by laminating a first element wafer including a first optical element and a second element wafer including a second optical element, with the bonding sheet being arranged between the first element wafer and the second element wafer; a curing process of performing a curing treatment on an uncured region of the bonding sheet; and a process of cutting the laminated wafer and segmenting the laminated wafer into optical units.