公开(公告)号：US20210096354A1

公开(公告)日：2021-04-01

申请号：US17028015

申请日：2020-09-22

Applicant: OLYMPUS CORPORATION

Inventor： Keiichi KOBAYASHI ,  Takatoshi IGARASHI ,  Takahiro SHIMOHATA

IPC: G02B23/24

Abstract: An image pickup apparatus includes an image pickup module in which an image pickup device is laminated, a relay board having a plurality of flying leads which are electrically connected to a proximal end face of the image pickup module through ultrasonic wire bonding, and a plurality of cables electrically connected to a plurality of connection lands of the relay board, and a bent portion is formed on the relay board so that the plurality of cables are fitted within a projection surface of the proximal end face of the image pickup module.

公开(公告)号：US20200046210A1

公开(公告)日：2020-02-13

申请号：US16656648

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Takahiro SHIMOHATA ,  Takuro SUYAMA

IPC: A61B1/05 ,  A61B1/00 ,  G06T7/00

Abstract: An image pickup module includes a stacked device in which a plurality of elements are stacked, adjacent elements are electrically connected together by element joints and a rear surface electrode is arranged on a rear surface, a wiring board in which a first electrode electrically connected to the rear surface electrode by a relay joint and a second electrode electrically connected to the first electrode via a relay wiring pattern are arranged, and a signal cable electrically connected to the second electrode via a cable joint, and in the stacked device, of a first region and a second region obtained by dividing the rear surface into two portions, the element joints are arranged only in a first space in which the first region is extended in an optical axis direction and the rear surface electrode is arranged only in the second region.

公开(公告)号：US20200059576A1

公开(公告)日：2020-02-20

申请号：US16661315

申请日：2019-10-23

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro SHIMOHATA

IPC: H04N5/225

Abstract: An endoscope includes an image pickup apparatus disposed in a rigid distal end portion. The image pickup apparatus is provided with: an imager with an external electrode being disposed on a rear face; a signal cable, a distal end portion of which is bonded to the external electrode of the imager; and resin sealing a bonding junction between the external electrode and the distal end portion and being accommodated in a space formed when the rear face is supposed to be extended in a direction of an optical axis of the imager. A rear end position of the resin is defined by a resin stopping portion of the signal cable.

公开(公告)号：US20190260917A1

公开(公告)日：2019-08-22

申请号：US16403782

申请日：2019-05-06

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takuro SUYAMA ,  Takahiro SHIMOHATA ,  Takatoshi IGARASHI ,  Hiroshi KOBAYASHI

IPC: H04N5/225 ,  A61B1/05 ,  H01L27/146

Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

公开(公告)号：US20160358965A1

公开(公告)日：2016-12-08

申请号：US15241741

申请日：2016-08-19

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Takahiro SHIMOHATA

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/02

CPC classification number: H01L27/14632 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/335 ,  H05K1/028 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/0187 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09472 ,  H05K2201/09909 ,  H01L2924/00

Abstract: An image pickup apparatus is an image pickup apparatus including: an image pickup device including a plurality of electrode pads provided in a row on an outer peripheral portion of a light-receiving surface on which a light-receiving section is formed, the plurality of electrode pads being connected to the light-receiving section; and a wiring board including a plurality of inner leads connected to respective electrode pads, wherein each of the inner leads includes a distal end portion, a bent portion and a rear end portion, the distal end portion is connected to the corresponding electrode pad, the bent portion includes a first bent portion having a recess shape relative to the light-receiving surface and a second bent portion having a protruding shape relative to the light-receiving surface, and the rear end portion is disposed in parallel with a side face of the image pickup device.

Abstract translation: 图像拾取装置是一种图像拾取装置，包括：图像拾取装置，包括在其上形成有光接收部分的受光表面的外周部分上设置成一行的多个电极焊盘，所述多个电极 焊盘连接到光接收部分; 以及布线基板，其具有与各个电极焊盘连接的多个内部引线，其中，所述内部引线中的每一个包括前端部，弯曲部和后端部，所述前端部与相应的电极焊盘连接， 弯曲部分包括相对于光接收表面具有凹槽形状的第一弯曲部分和相对于光接收表面具有突出形状的第二弯曲部分，并且后端部分与第二弯曲部分 图像拾取装置。

公开(公告)号：US20240079425A1

公开(公告)日：2024-03-07

申请号：US18508710

申请日：2023-11-14

Applicant: OLYMPUS CORPORATION

Inventor： Naoki ITO ,  Takatoshi IGARASHI ,  Keiichi KOBAYASHI ,  Takahiro SHIMOHATA

IPC: H01L27/146 ,  H04N23/50 ,  H04N23/54

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H04N23/54 ,  H04N23/555 ,  A61B1/051

Abstract: An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.

公开(公告)号：US20210141210A9

公开(公告)日：2021-05-13

申请号：US16656788

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Takahiro SHIMOHATA ,  Takuro SUYAMA

IPC: G02B23/24 ,  H04N5/225 ,  H01L27/146

Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

公开(公告)号：US20190214426A1

公开(公告)日：2019-07-11

申请号：US16352954

申请日：2019-03-14

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro SHIMOHATA ,  Takatoshi IGARASHI

IPC: H01L27/146 ,  A61B1/05 ,  H04N5/369

CPC classification number: H01L27/14636 ,  A61B1/04 ,  A61B1/05 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H04N5/369

Abstract: An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.

公开(公告)号：US20190076002A1

公开(公告)日：2019-03-14

申请号：US16188488

申请日：2018-11-13

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro SHIMOHATA

IPC: A61B1/00 ,  A61B1/05 ,  G02B7/02 ,  H01L27/146

Abstract: A lens unit includes a plurality of optical elements stacked, each of the plurality of optical elements including a glass substrate as a base, the glass substrates having a same size in respective cross-sections in a direction orthogonal to an optical path, and the optical elements are lens elements with resin lenses disposed on the respective bases, and each of the plurality of optical elements includes an annular recess portion surrounding the optical path and extending through the glass substrate, and a light shielding wall made of a light shielding material charged in the recess portion.

公开(公告)号：US20180042109A1

公开(公告)日：2018-02-08

申请号：US15782987

申请日：2017-10-13

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro SHIMOHATA

IPC: H05K1/14 ,  A61B1/00 ,  H05K1/11 ,  A61B1/04

CPC classification number: H05K1/144 ,  A61B1/00124 ,  A61B1/041 ,  H01L27/14618 ,  H01L27/14636 ,  H05K1/111 ,  H05K1/119 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/09072 ,  H05K2201/09118 ,  H05K2201/09381 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0465

Abstract: A connection structure includes: a wiring board including a plurality of first electrodes that are arranged on a principal surface; a molded interconnect device (MID) made of a non-electroconductive resin as a base material, the MID including a side surface and a bottom surface, the bottom surface being parallel to the principal surface of the wiring board and including a plurality of arranged second electrodes, and the side surface being perpendicular to the principal surface of the wiring board; and a plurality of electroconductive members each made of an electroconductive paste, each of the electroconductive members electrically connecting each of the plurality of first electrodes to each of the plurality of second electrodes, in which the plurality of electroconductive members are housed in respective reservoir sections formed by the second member and are not in contact with the non-electroconductive resin.