公开(公告)号：US20240079425A1

公开(公告)日：2024-03-07

申请号：US18508710

申请日：2023-11-14

Applicant: OLYMPUS CORPORATION

Inventor： Naoki ITO ,  Takatoshi IGARASHI ,  Keiichi KOBAYASHI ,  Takahiro SHIMOHATA

IPC: H01L27/146 ,  H04N23/50 ,  H04N23/54

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H04N23/54 ,  H04N23/555 ,  A61B1/051

Abstract: An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.