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    PACKAGING METHOD FOR ELECTRONIC DEVICE AND PACKAGING SYSTEM
    2.
    发明申请
    PACKAGING METHOD FOR ELECTRONIC DEVICE AND PACKAGING SYSTEM 有权
    电子设备和包装系统的包装方法

    公开(公告)号：US20170047538A1

    公开(公告)日：2017-02-16

    申请号：US14913090

    申请日：2015-07-16

    申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

    发明人： Zhiliang JIANG ,  Minghua XUAN ,  Fengli JI ,  Bo ZHANG ,  Fei CHEN ,  Renrong GAI

    IPC分类号： H01L51/52 ,  H01L51/56 ,  H01L23/00

    CPC分类号： H01L51/52 ,  H01L23/562 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/105

    摘要： The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

    摘要翻译： 本发明提供了一种电子设备的封装方法，其包括形成封装基板的步骤，形成封装基板的步骤包括：在基底基板上形成限定图案，所述限定图案包括用于限定位置的位置的凹槽 玻璃料 在凹槽中提供胶体玻璃料; 预先烧结胶体玻璃料以获得预先固化的玻璃料; 抛光定义图案的上表面和预先固化的玻璃料; 并去除定义图案，并完全固化预先固化的玻璃料，从而在基底基材上形成固体玻璃料。 本发明还提供一种包装系统。 通过使用本发明提供的包装方法，可以实现更好的包装效果。

    ENCAPSULATING METHOD, DISPLAY PANEL AND DISPLAY APPARATUS
    4.
    发明申请
    ENCAPSULATING METHOD, DISPLAY PANEL AND DISPLAY APPARATUS 审中-公开
    封装方法，显示面板和显示设备

    公开(公告)号：US20160365535A1

    公开(公告)日：2016-12-15

    申请号：US14905504

    申请日：2015-04-23

    申请人： ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

    发明人： Zhiliang JIANG

    IPC分类号： H01L51/52 ,  H01L51/56 ,  H01L27/32

    CPC分类号： H01L51/5246 ,  H01L27/32 ,  H01L51/56

    摘要： An encapsulating method, a display panel and a display apparatus, the encapsulating method including: forming a frit layer in an encapsulating area of a first substrate; forming a glass network modifier oxide layer on the surface of the frit layer; a first-sintering for the frit layer and the glass network modifier oxide layer; and aligning and attaching the first substrate and a second substrate, and forming an encapsulating structure through irradiating the encapsulating area by a laser. The encapsulating method can improve the liquidity of the surface of the frit layer and make the surface of the frit planarization after sintering at high temperature, so that the production of the holes of the surface of the frit layer can be reduced in the process of being encapsulated by a laser, and then the effect of encapsulating is improved.

    摘要翻译： 封装方法，显示面板和显示装置，所述封装方法包括：在第一基板的封装区域中形成玻璃料层; 在玻璃料层的表面上形成玻璃网络改性剂氧化物层; 用于玻璃料层和玻璃网络改性剂氧化物层的第一烧结; 以及对准和附接第一基板和第二基板，并且通过用激光照射封装区域形成封装结构。 封装方法可以提高玻璃料层的表面的流动性，并使高温烧结后的玻璃料平面化的表面，从而可以在玻璃料层的表面的生成过程中减少玻璃料层表面的孔的产生 通过激光封装，然后改善封装的效果。

    DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
    5.
    发明申请
    DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE 审中-公开

    公开(公告)号：US20200075685A1

    公开(公告)日：2020-03-05

    申请号：US16610636

    申请日：2019-04-18

    申请人： Ordos Yuansheng Optoelectronics Co., Ltd. ,  BOE Technology Group Co., Ltd.

    发明人： Zhiliang JIANG ,  Kai ZHANG ,  Yangpeng WANG ,  Guoqiang TANG ,  Jianjun WU

    IPC分类号： H01L27/32

    摘要： The present disclosure discloses a display panel and a manufacturing method thereof, and a display device. The display panel includes: a second substrate and a first substrate which are oppositely disposed, and a touch circuit located on the side, facing the second substrate, of the first substrate. The touch circuit includes a first contact portion, and a plurality of contact electrodes are disposed on the side, facing the second substrate, of the first contact portion. The second substrate includes a second contact portion corresponding to the first contact portion. A plurality of contact pads are disposed on the side, facing the first substrate, of the second contact portion. The contact pads are in direct contact connection with the contact electrodes.

    PACKAGE STRUCTURE, PACKAGING METHOD AND DISPLAY DEVICE
    6.
    发明申请
    PACKAGE STRUCTURE, PACKAGING METHOD AND DISPLAY DEVICE 审中-公开

    公开(公告)号：US20200259114A1

    公开(公告)日：2020-08-13

    申请号：US16097665

    申请日：2018-02-06

    申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

    发明人： Zhiliang JIANG

    IPC分类号： H01L51/52 ,  H01L51/00 ,  H01L51/56

    摘要： The present disclosure relates to package structure, packaging method and display device. A package structure comprises: a first substrate and a second substrate disposed opposite to each other, a peripheral portion of at least one of the first substrate and the second substrate being provided with a sealing hole; a first sealing structure disposed between the first substrate and the second substrate and located at a peripheral region of the first substrate; and a second sealing structure disposed in the sealing hole, wherein the first sealing structure is bonded to the second sealing structure.

    PACKAGING METHOD, DISPLAY PANEL, DISPLAY DEVICE AND PACKAGING APPARATUS
    7.
    发明申请
    PACKAGING METHOD, DISPLAY PANEL, DISPLAY DEVICE AND PACKAGING APPARATUS 审中-公开
    包装方法，显示面板，显示装置和包装装置

    公开(公告)号：US20170077443A1

    公开(公告)日：2017-03-16

    申请号：US15137360

    申请日：2016-04-25

    申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

    发明人： Zhiliang JIANG

    IPC分类号： H01L51/52 ,  H01L51/56

    CPC分类号： H01L51/5246 ,  C03C23/0025 ,  C03C27/00 ,  H01L51/56

    摘要： A packaging method comprising forming a frit on a first substrate, affixing a second substrate to the first substrate in position, and irradiating the frit by laser beam so as to melt the frit. The packaging method further comprises performing an ultrasonic treatment on the frit by means of ultrasonic wave when the frit being melted. A display panel packaged by the packaging method and a display device having the display panel are disclosed. Further, a packaging device for performing the packaging method is also disclosed.

    摘要翻译： 一种包装方法，包括在第一基板上形成玻璃料，将第二基板固定到第一基板就位，以及通过激光束照射玻璃料以熔化玻璃料。 包装方法还包括当玻璃料熔化时通过超声波在玻璃料上进行超声波处理。 公开了一种通过包装方法包装的显示面板和具有显示面板的显示装置。 此外，还公开了一种用于执行包装方法的包装装置。