公开(公告)号：US10225933B2

公开(公告)日：2019-03-05

申请号：US15294592

申请日：2016-10-14

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Heiko Heppner

IPC: H05K1/14 ,  F21V23/06 ,  H01L51/00 ,  H01R12/79 ,  H05K1/11 ,  H05K1/18 ,  H05K3/36 ,  F21K9/20 ,  F21Y115/15 ,  H01L51/52 ,  H05K1/02 ,  H05K1/16

Abstract: In one embodiment, the organic light emitting diode (1) comprises a carrier substrate (2) having an organic layer stack for producing light. The organic light emitting diode (1) is electrically connectable via at least one connector (3) as intended. The connector (3) has two main sides (32) situated opposite one another that each have at least two electrical contact pads (31) of the connector (3) located on them. As seen in a cross section perpendicular to the main sides (32) and perpendicular to an insertion direction (x) of the connector (3), the contact pads (31) are arranged both geometrically and with electrical point symmetry, so that incorrect-polarity protection against incorrect electrical connection of the organic light emitting diode (1) is attained.

公开(公告)号：US10600999B2

公开(公告)日：2020-03-24

申请号：US15558576

申请日：2016-03-15

Applicant: OSRAM OLED GmbH

Inventor： Heiko Heppner ,  Egbert Hoefling ,  Dieter Musa ,  Simon Schicktanz

IPC: H01L51/00 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H01L51/50

Abstract: According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.

公开(公告)号：US20180062118A1

公开(公告)日：2018-03-01

申请号：US15558576

申请日：2016-03-15

Applicant: OSRAM OLED GmbH

Inventor： Heiko Heppner ,  Egbert Hoefling ,  Dieter Musa ,  Simon Schicktanz

IPC: H01L51/56 ,  H01L51/00 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L51/56 ,  H01L27/3202 ,  H01L27/3204 ,  H01L51/0006 ,  H01L51/0021 ,  H01L51/003 ,  H01L51/5012 ,  H01L51/5203 ,  H01L51/5206 ,  H01L51/5234 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5253

Abstract: According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.