公开(公告)号：US20210312851A1

公开(公告)日：2021-10-07

申请号：US17264706

申请日：2019-09-09

Applicant: OSRAM OLED GmbH

Inventor： Stefan ILLEK ,  Hubert HALBRITTER ,  Korbinian PERZLMAIER

IPC: G09G3/20 ,  G09G3/3233

Abstract: An LED display having a plurality of pixels is described. The pixels each include at least one inorganic LED and at least one organic LED. Furthermore, a method of operating the LED display is specified.

公开(公告)号：US20220123189A1

公开(公告)日：2022-04-21

申请号：US17275675

申请日：2019-09-12

Applicant: OSRAM OLED GMBH

Inventor： Korbinian PERZLMAIER ,  Alexander F. PFEUFFER ,  Kerstin NEVELING

IPC: H01L33/62 ,  H01L33/38

Abstract: An optoelectronic semiconductor element may include an optoelectronic semiconductor chip. The optoelectronic semiconductor chip may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first contact element connected to the first semiconductor layer in an electrically conductive manner, and a second contact element connected to the second semiconductor layer in an electrically conductive manner. The first semiconductor layer and the second semiconductor layer are arranged one above the other to form a layer stack. The first semiconductor layer to where the second semiconductor layer is exposed. The first contact element is arranged over the first semiconductor layer, and the second contact element is arranged over the first semiconductor layer.

公开(公告)号：US20210074888A1

公开(公告)日：2021-03-11

申请号：US17072899

申请日：2020-10-16

Applicant: OSRAM OLED GmbH

Inventor： Christian LEIRER ,  Korbinian PERZLMAIER

IPC: H01L33/38 ,  H01L33/08 ,  H01L33/36 ,  H01L27/146 ,  H01L27/15 ,  H01L31/0224 ,  H01L31/0232 ,  H01L33/40

Abstract: A surface-mountable electrical device, an assembly including the surface-mountable electrical device, and a method for producing the surface-mountable electrical device is provided. The surface-mountable electrical device includes at least one electrical component which is a semiconductor component and which is intended for generating radiation, a control circuit for pulsed operation of the component, and a capacitor which is connected to the component electrically in series and which is configured for the pulsed energization of the component. The surface-mountable electrical device further includes a lead frame assembly having a plurality of different lead frames as a mounting platform for the component, the capacitor and the control circuit, wherein at least one of the different lead frames of the lead frame assembly is thinner than a further lead frame of the different lead frames and the lead frame assembly lies only partially in a mounting side of the device.

公开(公告)号：US20230054120A1

公开(公告)日：2023-02-23

申请号：US17973247

申请日：2022-10-25

Applicant: OSRAM OLED GmbH

Inventor： Christian LEIRER ,  Korbinian PERZLMAIER

IPC: H01L33/38 ,  H01L33/08 ,  H01L33/36 ,  H01L27/146 ,  H01L27/15 ,  H01L31/0224 ,  H01L31/0232 ,  H01L33/40

Abstract: An optoelectronic arrangement is specified, including a moulded body having a base surface, a first pixel group with a multiplicity of pixels assigned thereto, each having a first semiconductor region, a second semiconductor region and an active region, a multiplicity of separating structures arranged between the pixels, and at least one first contact structure having a first contact plane and a first contact location, which is freely accessible at the base surface, wherein the pixels of the first pixel group are arranged alongside one another at the top surface, the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are electrically insulated from one another by means of the separating structures, a first contact structure is assigned one-to-one to the first pixel group, and the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location.