公开(公告)号：US11598667B2

公开(公告)日：2023-03-07

申请号：US17277993

申请日：2019-09-18

Applicant: OSRAM OLED GmbH

Inventor： Christian Leirer ,  Christian Mueller ,  Ulrich Steegmüller

IPC: G01J3/02 ,  G01J3/10 ,  G01J3/28 ,  G01J3/42 ,  G01N21/31

Abstract: In an embodiment a measuring unit includes a light emitting LED component including a housing occupying a housing surface G and an LED chip located within the housing, the LED chip including a light emitting light surface L and being configured to emit light; a photodetector configured to detect reflected light reflected from a measured object originating from the LED component and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.

公开(公告)号：US20210348967A1

公开(公告)日：2021-11-11

申请号：US17277993

申请日：2019-09-18

Applicant: OSRAM OLED GmbH

Inventor： Christian Leirer ,  Christian Mueller ,  Ulrich Steegmüller

IPC: G01J3/02 ,  G01J3/10 ,  G01J3/28 ,  G01J3/42 ,  G01N21/31

Abstract: In an embodiment a measuring unit includes a light emitting LED component including a housing occupying a housing surface G and an LED chip located within the housing, the LED chip including a light emitting light surface L and being configured to emit light; a photodetector configured to detect reflected light reflected from a measured object originating from the LED component and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.