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公开(公告)号：US12068281B2
公开(公告)日：2024-08-20
申请号：US17261505
申请日：2019-08-07
Applicant: OSRAM OLED GMBH
Inventor： Christian Leirer , Michael Schumann
IPC: H01L25/065 , H01L25/16 , H01L33/00 , H01L33/44 , H01L33/62
CPC classification number: H01L25/0657 , H01L25/167 , H01L33/005 , H01L33/44 , H01L33/62 , H01L2933/0066
Abstract: In an embodiment, the semiconductor device is surface mountable and comprises a light emitting semiconductor chip which comprises electrical contact pads. An opaque base body laterally surrounds the semiconductor chip. An electrical fanning layer contains electrical conductor tracks. Electrical connection pads are used for external electrical contacting of the semiconductor device. The contact pads and the connection pads are located on different sides of the fanning layer. The contact pads are electrically connected to the associated connection pads by means of the fanning layer. The connection pads are expanded relative to the contact pads.
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公开(公告)号：US10763406B2
公开(公告)日：2020-09-01
申请号：US15760209
申请日：2016-09-14
Applicant: OSRAM OLED GMBH
Inventor： Korbinian Perzlmaier , Christian Leirer
IPC: H01L29/08 , H01L33/00 , H01L31/0203 , H01L21/00 , H01L51/40 , H01L33/54 , H01L33/48 , H01L33/50 , H01L33/62 , H01L33/44 , H01L21/56 , H01L33/60 , H01L33/46 , H01L33/56
Abstract: The invention relates to a semiconductor component comprising: a semiconductor chip (10) which has a semiconductor body (1) with an active region (12) and a substrate (3) with a first conductor body (31), a second conductor body (32) and a first moulded body (33); and a second moulded body (5); wherein the second moulded body (5) completely surrounds the semiconductor chip (10) in lateral directions (L), the semiconductor chip (10) extends all the way through the second moulded body (5) in a vertical direction (V), at least some parts of an upper side and a lower side of the semiconductor chip (10) are not covered by the second moulded body (5), the substrate (3) is mechanically connected to the semiconductor body (2), the active region (12) is connected to the first conductor body (31) and the second conductor body (32) in an electroconductive manner, and the second moulded body (5) is directly adjacent to the substrate (3) and the semiconductor body (1).
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公开(公告)号：US11598667B2
公开(公告)日：2023-03-07
申请号：US17277993
申请日：2019-09-18
Applicant: OSRAM OLED GmbH
Inventor： Christian Leirer , Christian Mueller , Ulrich Steegmüller
Abstract: In an embodiment a measuring unit includes a light emitting LED component including a housing occupying a housing surface G and an LED chip located within the housing, the LED chip including a light emitting light surface L and being configured to emit light; a photodetector configured to detect reflected light reflected from a measured object originating from the LED component and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.
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公开(公告)号：US11177233B2
公开(公告)日：2021-11-16
申请号：US16348602
申请日：2017-11-10
Applicant: OSRAM OLED GmbH
Inventor： Christian Leirer , Martin Rudolf Behringer
Abstract: An optoelectronic semiconductor chip includes a rear side with a center and with two contact points for electrical contacting of the semiconductor chip, the contact points being spaced apart from one another, and two solder pads arranged on the contact points, wherein the center is located in a region between the contact points, the solder pads protrude from the rear side and are exposed, and on average, the solder pads are thicker further away from the center than in the vicinity of the center or vice versa.
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Patent Agency Ranking
公开(公告)号：US20210348967A1
公开(公告)日：2021-11-11
申请号：US17277993
申请日：2019-09-18
Applicant: OSRAM OLED GmbH
Inventor： Christian Leirer , Christian Mueller , Ulrich Steegmüller
Abstract: In an embodiment a measuring unit includes a light emitting LED component including a housing occupying a housing surface G and an LED chip located within the housing, the LED chip including a light emitting light surface L and being configured to emit light; a photodetector configured to detect reflected light reflected from a measured object originating from the LED component and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.
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公开(公告)号：US10680135B2
公开(公告)日：2020-06-09
申请号：US15770334
申请日：2016-10-24
Applicant: OSRAM OLED GMBH
Inventor： Berthold Hahn , Korbinian Perzlmaier , Christian Leirer , Anna Kasprzak-Zablocka
Abstract: The invention relates to an optoelectronic component (100) comprising a semiconductor layer sequence (1) having an active layer (10), wherein the active layer (10) is designed to produce or absorb electromagnetic radiation in intended operation. Furthermore, the component (100) comprises a first contact structure (11) and a second structure (12), by means of which the semiconductor layer sequence (1) can be electrically contacted in intended operation. In operation, a voltage is applied to the contact structures (11, 12), wherein an operation-related voltage difference ΔUbet between the contact structures (11, 12) arises. When the voltage difference is increased, a first arc-over occurs in or on the component (100) between the two contact structures (11, 12). A spark gap (3) between the contact structures (11, 12), which arises in the event of the first arc-over, passes predominantly through a surrounding medium in the form of gas or vacuum and/or through a potting. The first arc-over occurs at a voltage difference of 2·ΔUbet at the earliest.
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公开(公告)号：US10665758B2
公开(公告)日：2020-05-26
申请号：US15747188
申请日：2016-07-14
Applicant: OSRAM OLED GmbH
Inventor： Christian Leirer , Thomas Schwarz , Lutz Höppel
Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.
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公开(公告)号：US11527678B2
公开(公告)日：2022-12-13
申请号：US17072899
申请日：2020-10-16
Applicant: OSRAM OLED GmbH
Inventor： Christian Leirer , Korbinian Perzlmaier
IPC: H01L33/38 , H01L27/146 , H01L27/15 , H01L31/0224 , H01L31/0232 , H01L33/08 , H01L33/36 , H01L33/40
Abstract: An optoelectronic arrangement is specified, comprising a moulded body having a base surface, a first pixel group with a multiplicity of pixels assigned thereto, each having a first semiconductor region, a second semiconductor region and an active region, a multiplicity of separating structures arranged between the pixels, and at least one first contact structure having a first contact plane and a first contact location, which is freely accessible at the base surface, wherein the pixels of the first pixel group are arranged alongside one another at the top surface, the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are electrically insulated from one another by means of the separating structures, a first contact structure is assigned one-to-one to the first pixel group, and the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location.
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公开(公告)号：US10854783B2
公开(公告)日：2020-12-01
申请号：US15743606
申请日：2016-07-07
Applicant: OSRAM OLED GMBH
Inventor： Christian Leirer , Korbinian Perzlmaier
IPC: H01L33/38 , H01L33/08 , H01L27/146 , H01L27/15 , H01L31/0224 , H01L31/0232 , H01L33/36 , H01L33/40
Abstract: An optoelectronic arrangement is specified, comprising a moulded body (2) having a base surface (2b), a first pixel group (41) with a multiplicity of pixels (1) assigned thereto, each having a first semiconductor region (11), a second semiconductor region (12) and an active region (10), a multiplicity of separating structures (3) arranged between the pixels (1), and at least one first contact structure (51, 52, 53) having a first contact plane (51) and a first contact location (52), which is freely accessible at the base surface (2b), wherein the pixels (1) of the first pixel group (41) are arranged alongside one another at the top surface (2a), the first semiconductor regions (11) and/or the second semiconductor regions (12) of adjacent pixels (1) of the first pixel group (41) are electrically insulated from one another by means of the separating structures (3), a first contact structure (51, 52, 53) is assigned one-to-one to the first pixel group (41), and the first semiconductor regions (11) of the pixels (1) of the first pixel group (41) are electrically conductively connected to one another by means of the first contact plane (51) and are electrically contactable by means of the first contact location (52).
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