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公开(公告)号：US20190035972A1
公开(公告)日：2019-01-31
申请号：US16072993
申请日：2017-01-26
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Michael ZITZLSPERGER , Tobias GEBUHR , Stephan EICHER
Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.
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