公开(公告)号：US20220278028A1

公开(公告)日：2022-09-01

申请号：US17629038

申请日：2020-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias HIEN ,  Michael ZITZLSPERGER

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

公开(公告)号：US20180159009A1

公开(公告)日：2018-06-07

申请号：US15576043

申请日：2016-04-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas SCHWARZ ,  Michael ZITZLSPERGER

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/641 ,  H01L23/142 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: The invention relates to a method for producing an electronic component with a carrier element (100), with the steps: producing the carrier element (100), having the steps A) providing a first metal layer (1) comprising a first metal material, wherein the first metal layer (1) has a first and a second main surface (10, 11) which face away from one another, B) applying a second metal layer (2) comprising a second metal material on at least one of the main surfaces (10, 11), C) converting a part of the second metal layer (2) into a dielectric ceramic layer (3), wherein the second metal material forms a component of the ceramic layer (3), and the ceramic layer (3) forms a surface (30) which faces away from the first metal layer (1) and is above the second metal layer (2);—arranging at least one electronic semiconductor chip (21) on the carrier element (100). The invention further relates to an electronic component with a carrier element (100).

公开(公告)号：US20170365752A1

公开(公告)日：2017-12-21

申请号：US15533005

申请日：2015-12-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas SCHWARZ ,  Frank SINGER ,  Stefan ILLEK ,  Michael ZITZLSPERGER ,  Britta GOEOETZ ,  Dominik SCHULTEN

IPC: H01L33/50 ,  H01L33/48

CPC classification number: H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: Disclosed is a conversion element (100). The conversion element (100) comprises: a conversion coating (16), which contains a wavelength-converting conversion material; a first encapsulation coating (30) on a first main surface (20) of the conversion coating, said first encapsulation coating having a thickness of between 10 μm and 500 μm; and a second encapsulation coating (32) on a second main surface (22) of the conversion coating, said second encapsulation coating having a thickness of between 0.1 μm and 20 μm. Also disclosed are an optoelectronic semiconductor component (200) and a method for producing conversion elements.

公开(公告)号：US20220140215A1

公开(公告)日：2022-05-05

申请号：US17431073

申请日：2020-02-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael ZITZLSPERGER ,  Matthias GOLDBACH ,  Benjamin HÖFLINGER

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L33/00 ,  H01L33/48 ,  H01L23/495

Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.

公开(公告)号：US20190035972A1

公开(公告)日：2019-01-31

申请号：US16072993

申请日：2017-01-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael ZITZLSPERGER ,  Tobias GEBUHR ,  Stephan EICHER

IPC: H01L33/00 ,  H01L33/48 ,  H01L23/00

Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.